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Electronics module comprising a device for dissipating heat generated by a semiconductor unit in a plastic housing, and method for the production of an electronics module

一种电子模块、热量的技术，应用在电路、电气元件、半导体器件等方向

Active Publication Date: 2017-02-22
ROBERT BOSCH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage here is that a separate heat sink is required and has to be installed in the housing in an additional work step

Method used

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  • Electronics module comprising a device for dissipating heat generated by a semiconductor unit in a plastic housing, and method for the production of an electronics module
  • Electronics module comprising a device for dissipating heat generated by a semiconductor unit in a plastic housing, and method for the production of an electronics module
  • Electronics module comprising a device for dissipating heat generated by a semiconductor unit in a plastic housing, and method for the production of an electronics module

Examples

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Embodiment Construction

[0034] Figure 1aA schematic diagram of an electronic module according to a first embodiment of the invention is shown, which has a device for dissipating heat generated by semiconductor devices arranged in a plastic housing.

[0035] The electronics module 1 has a semiconductor device 14 arranged in a plastic housing 12 and a device 10 for dissipating the heat generated by the semiconductor device 14 arranged in the plastic housing 12 . The device 10 for dissipating heat generated by semiconductor devices 14 arranged in a plastic housing 12 has an electrically conductive plate assembly 16 which both supplies the semiconductor devices 14 with electrical power and dissipates the heat generated by the semiconductor devices 14 to the plastic housing. body 12. The electrically conductive plate assembly 16 is preferably formed by a stamped grid. The punched grid preferably has multiple layers of metal strips which are connected or stacked to form a punched grid pack. Alternativel...

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PUM

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Abstract

The invention relates to an electronics module comprising a semiconductor unit (14) in a plastic housing (12), and an electrically conductive plate arrangement (16) via which the semiconductor unit (14) can be supplied with electric power and which is connected in a planar manner to a heat-generating integrated circuit (14b) of the semiconductor unit (14) via a heat coupling element (18), the electrically conductive plate arrangement (16) being designed in such a way as to dissipate the heat generated by the heat-generating integrated circuit (14b) of the semiconductor unit (14) to the plastic housing (12). The invention further relates to a method for producing a corresponding electronics module.

Description

technical field [0001] The invention relates to an electronic module having a device for dissipating heat generated by semiconductor devices arranged in a plastic housing, and to a method for producing the electronic module. Background technique [0002] At present, the heat dissipation in electronically controlled appliances, which have a high power loss compared to the overall size, is essentially controlled by the choice of housing material. Aluminum has favorable properties as a housing material with regard to heat dissipation, but aluminum is more expensive than plastic. If plastic is used as the housing material, it is usually necessary to significantly increase the overall size of the control device in order to achieve a sufficient heat dissipation. In order to be able to dissipate heat from the control device, a good heat transfer between the control device and the surrounding environment is required. Plastics, however, conduct heat poorly, so that the places where...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/433H01L23/495
CPCH01L23/4334H01L23/49537H01L23/49568H01L23/49575H01L2924/0002H01L2924/00H01L23/49548
Inventor T·施奈德
Owner ROBERT BOSCH GMBH
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