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Radio frequency module

A technology of high-frequency modules and module substrates, applied in the direction of electrical components, multi-terminal pair networks, transmission systems, etc., to achieve the effect of improving isolation characteristics and improving attenuation characteristics

Active Publication Date: 2017-02-22
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that the size of the filter circuit 500 is increased, and the high-frequency module including the filter circuit 500 is increased in size.

Method used

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Experimental program
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no. 1 approach ＞

[0035] refer to Figure 1 ~ Figure 4 A first embodiment of the high-frequency module according to the present invention will be described. In addition, in figure 1 as well as figure 2In the figure, only the main configurations related to the present invention are shown, and other configurations are omitted from illustration for simplicity of description. In addition, each drawing referred to in the following description is also the same as figure 1 as well as figure 2 In the same way, only the main configurations are shown, and the description thereof will be omitted in the following description.

[0036] (high frequency module)

[0037] figure 1 as well as figure 2 The shown high-frequency module 1 is mounted on a mother board provided in a communication mobile terminal such as a mobile phone or a mobile information terminal. device), module substrate 2, matching circuit 3, inductor circuit 20, switch IC, filter, resistor, capacitor, coil and other electronic co...

no. 2 approach ＞

[0085] refer to Figure 5 as well as Image 6 A second embodiment of the high-frequency module according to the present invention will be described.

[0086] like Figure 5 as well as Image 6 As shown, the difference between this embodiment and the above-mentioned first embodiment is that the wiring electrode 4 forming the first inductor L1a is arranged directly under the wave splitter 10, and the first inductor L1a is connected to the transmission path 16a in the wave splitter Alternatively, the reception paths 16b in the duplexer are connected at high frequency by electromagnetic field coupling to form the propagation path WP. In addition, between the first inductor L1a and the second inductor L1b, the ground electrode 30 for shielding formed by the wiring electrode 4 connected to the ground terminal GNDa of the module substrate suppresses the first inductor L1a and the second inductor L1a. The electromagnetic field coupling method of L1b is configured between the first...

no. 3 approach ＞

[0089] refer to Figure 7 A third embodiment of the high-frequency module according to the present invention will be described. Figure 7 It is a diagram when a part (main part) of the module substrate 2 of the high-frequency module 1 is planarly viewed from the mounting surface 2a side.

[0090] like Figure 7 As shown, this embodiment is different from the above-mentioned first embodiment in that the chip-type surface mount component 7 forming the first inductor L1a and the chip-type surface mount component 3a (inductor) forming the matching circuit 3 are mounted on The mounting surface 2 a of the module substrate 2 and the surface mounting component 7 are disposed adjacent to the surface mounting component 3 a. In addition, as shown in the figure, the surface mount component 7 and the area where the wiring electrodes 4 forming the second inductor L1b are arranged are arranged so as not to overlap each other in plan view. The other configurations are the same as those of ...

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PUM

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Abstract

Provided is a configuration capable of improving an attenuation characteristic of an RF signal outside a frequency band of a transmitting signal inputted to a transmitting terminal, and improving an isolation characteristic between a transmitting filter and a receiving filter without increasing the size of a radio frequency module. A propagation path WP for further improving a filter characteristic without deteriorating an attenuation characteristic outside a pass band of a transmitting filter 14 can be formed by a simple configuration, and consequently an attenuation characteristic of an RF signal outside a frequency band of a transmitting signal can be improved without increasing the size of a radio frequency module 1. Further, an RF signal outside the frequency band of the transmitting signal and within approximately the same frequency band as a received signal is prevented from going around from a signal path on the output terminal 14b side of the transmitting filter 14 to the receiving filter 15 side and being outputted from a receiving terminal Rxa, and consequently an isolation characteristic between the transmitting filter 14 and the receiving filter 15 can be improved.

Description

technical field [0001] The present invention relates to a high-frequency module having a function of demultiplexing a transmission signal and a reception signal. Background technique [0002] Conventionally, high-frequency modules equipped with filter circuits have been provided, for example, Figure 12 The shown filter circuit 500 is mounted on a high-frequency module (for example, refer to Patent Document 1). The filter circuit 500 includes a filter unit 503 connected between an input terminal 501 and an output terminal 502 , and a path 504 connected in parallel to the filter unit 503 . Therefore, the signal path through which the RF (Radio Frequency: radio frequency, high frequency) signal input to the input terminal 501 passes is branched into the path of the filter unit 503 and the path 504, so if the RF signal is input at the input terminal 501, the first signal 505 Through filter section 503 , second signal 506 passes through path 504 . Furthermore, an RF signal obt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B1/525H03H11/46
CPCH04B1/52H03H7/09H03H9/0542H03H9/0566H04B1/0458H04B1/18H04B1/525H03H7/463H03H9/706H03H9/725H03H9/64H03H7/0138H03H7/38H03H9/54
Inventor 菅谷行晃沟口真也
Owner MURATA MFG CO LTD
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