Sheet adhesion device and adhesion method

Abstract

The sheet adhering device (10) has: a first holding unit (20) holding an adherend (WF); A second holding unit (30) for holding the outer edge of the adhesive sheet (AS) facing the adherend (WF), a fluid supply unit (40) for supplying fluid, and a second holding unit (30) to hold the second holding unit (30). The adhesive sheet (AS) is pressed on the adherend (WF) held by the first holding unit (20) and adhered to the pressing unit (50), and the second holding unit (30) can form an adhesive sheet ( AS) inside the closed space (SP) surrounded by the first holding unit (20), the fluid supply unit (40) supplies fluid to the closed space (SP), so that the adhesive sheet (AS) is separated from the adherend ( WF) is deformed in the direction of WF), and the pressing unit (50) presses and adheres the deformed adhesive sheet (AS) to the adherend (WF).

Description

technical field [0001] The present invention relates to a sheet material adhesion device and adhesion method. Background technique [0002] At present, there is known a sheet adhering device for adhering an adhesive sheet disposed opposite to an adherend such as a semiconductor wafer (hereinafter simply referred to as a wafer) to the adherend (for example, refer to Document 1: JP Publication No. 2014-27081). [0003] Patent Document 1: Japanese Patent Laid-Open No. 2014-27081 [0004] However, in the conventional sheet adhering apparatus described in Document 1, the gas as a fluid is blown onto the adhesive sheet in an open space, and the adhesive sheet is attached to the wafer with the adhesive sheet kept at a certain distance from the wafer. The fluid must be continuously supplied until the sticking operation is completed, and there is a problem that the consumption of the fluid increases rapidly. [0005] In addition, since the distance between the adhesive sheet and t...

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Problems solved by technology

[0004] However, in the conventional sheet adhering apparatus described in Document 1, the gas as a fluid is blown onto the adhesive sheet in an open space, and the adhesive sheet is attached to the wafer with the adhesive sheet kept at a certain distance from the wafer. Fluid must be continuously supplied until the sticking operation ends, and there is a problem that the consumption of fluid increases rapidly

[0005] In addition, since the distance between the adhesive sheet and the wafer needs to be kept constant, there is a problem that the control for supplying the fluid becomes complicated.

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