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Apparatus for measuring thermal conductivity of fluid by using transient hot film method, solving method, and measurement method

A thermal conductivity and fluid technology, applied in the field of fluid thermophysical properties research, can solve problems such as thin hot wires and easy breakage

Active Publication Date: 2017-03-08
XI AN JIAOTONG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to solve the problem that the hot wire is thin and easy to break in both the transient hot wire method and the transient short wire method, the present invention provides a device for measuring fluid thermal conductivity using the transient hot film method, a solution method and a measurement method. The method is simple to operate, convenient to calculate, and can ensure measurement accuracy; the device has a reasonable structure and is easy to use

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  • Apparatus for measuring thermal conductivity of fluid by using transient hot film method, solving method, and measurement method
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  • Apparatus for measuring thermal conductivity of fluid by using transient hot film method, solving method, and measurement method

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Embodiment Construction

[0081] The present invention will be further described in detail below in conjunction with specific embodiments, which are explanations of the present invention rather than limitations.

[0082] The experimental method schematic diagram that the present invention adopts is as follows figure 1 As shown, there is a columnar insulating matrix in the middle, metal coating on the peripheral surface of the columnar insulating matrix, and the fluid to be measured is surrounded. When the current passes through the metal conductive film, thermal power is generated, and the heat is transmitted to the insulating substrate and the measured fluid at the same time. The thermal conductivity of the measured fluid can be obtained by measuring the variation of the temperature of the conductive film with time.

[0083] The method for solving the thermal conductivity of a fluid by using the transient hot film method includes the following steps:

[0084] (1) Establish a physical experiment mode...

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Abstract

The invention discloses an apparatus for measuring the thermal conductivity of a fluid by using a transient hot film method, a solving method, and a measurement method. According to the present invention, based on a physical vapor deposition technology, a layer of an electric conduction film is plated on the circumferential surface of a cylindrical insulating body, wherein the middle is a cylindrical insulating substrate, the circumferential surface of the cylinder is the metal plating film, the periphery is a fluid to be measured, the heat power is generated when the electric conduction film is electrified, and the heat is concurrently transmitted to the insulating substrate and the fluid to be measured; the electric conduction film is plated on the insulating substrate, such that the disadvantage that the easy breaking metal wire is adopted as the heat source in the transient hot wire method and the transient short wire method is completely avoided; and the calculation method uses the numerical calculation method and the parameter inversion algorithm mathematical tool in the numerical heat transfer, and the related measurement technology of the measurement system is improved in the transient hot wire method, such that it can be ensured that the experiment method has the same measurement precision as the transient hot wire method and the transient short wire method.

Description

technical field [0001] The invention belongs to the technical field of fluid thermophysical properties research, and in particular relates to a device for measuring fluid thermal conductivity using a transient hot film method, a solution method and a measurement method. Background technique [0002] Among the existing measurement methods of fluid thermal conductivity, the transient hot wire method is recognized as one of the most accurate methods in the world for measuring fluid thermal conductivity. Since the hot wire in the transient hot wire method requires a thinner diameter and a longer length, and is usually composed of a metal wire with a diameter of more than ten microns, it is very easy to break during the experimental operation. In order to overcome this shortcoming, on the basis of the transient hot wire method, the transient short wire method was proposed in 1997 by M.Fujii of Kyushu University in Japan. With the help of numerical calculation tools, the transien...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/20
CPCG01N25/20
Inventor 赵小明姚传奇
Owner XI AN JIAOTONG UNIV