Production device and method of high-purity oxygen-free copper ingot billet

A production device and technology of oxygen-free copper, which is applied in the field of high-purity oxygen-free copper ingot production device, can solve the problems such as unsatisfactory deoxidation effect, and achieve the advantages of density, buffering hydrostatic pressure fluctuation, and adjustable position Effect

Active Publication Date: 2017-03-15
JIANGXI GUANGXIN COPPER IND
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  • Abstract
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Problems solved by technology

[0006] Therefore, the technical problem to be solved by the present invention is that in the production process of the existing oxygen-free copper ingot, the incomplete contact between the deoxidizing gas and the copper liquid le...

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  • Production device and method of high-purity oxygen-free copper ingot billet
  • Production device and method of high-purity oxygen-free copper ingot billet
  • Production device and method of high-purity oxygen-free copper ingot billet

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Embodiment Construction

[0048] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0049] In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components. ...

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Abstract

The invention provides a production device of a high-purity oxygen-free copper ingot billet. The device comprises a melting furnace, a partition bin and a heat preservation furnace which are sequentially communicated, the partition bin is further provided with a deoxygenator, the deoxygenator comprises a gas conveying pipe used for conveying deoxygenation gas and an air exhaust cover which is located in the partition bin and connected with the outlet end of the gas conveying pipe, and a plurality of air exhaust holes with the diameter of 0.5 mm to 1 mm are formed in the air exhaust cover; the melting furnace and the partition bin are connected through a liquid inlet hole, the air exhaust cover right faces the liquid inlet hole, and the distance between the air exhaust cover and the liquid inlet hole ranges from 10 mm to 40 mm; in the flowing direction of molten copper, the projection of the air exhaust cover is larger than the projection of the liquid inlet hole; the invention further provides a method capable of adopting the device for producing the oxygen-free copper ingot billet. By the adoption of the method, the oxygen-free copper ingot billet which is good in production compactness and low in oxygen content can be produced.

Description

technical field [0001] The invention relates to the technical field of nonferrous metal processing, in particular to a production device for a high-purity oxygen-free copper ingot. Background technique [0002] Oxygen-free copper refers to pure copper that does not contain oxygen or any deoxidizer residue, but in fact oxygen-free copper still contains a very small amount of oxygen and some impurities. According to the national standard GB / T5231-2001 "Chemical composition and product shape of processed copper and copper alloy", the oxygen content in oxygen-free copper is not more than 0.003%, the total impurity content is not more than 0.05%, and the purity of copper is more than 99.95%. Among them, according to the level of oxygen content, oxygen-free copper is divided into TU0 (≤5ppm), TU1 (5-20ppm), TU2 (20-30ppm) and other grades. Due to the low oxygen and impurity content and high purity in oxygen-free copper, it has excellent electrical and thermal conductivity and duc...

Claims

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Application Information

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IPC IPC(8): C22B15/14C22B9/05
CPCC22B9/05C22B15/006
Inventor 黄四龙李明茂旷军平
Owner JIANGXI GUANGXIN COPPER IND
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