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Electric power conversion device

A technology for power conversion devices and conduits, which is applied to circuit thermal devices, electrical components, printed circuit components, etc., can solve the problems of heat recovery and low heat dissipation efficiency, and achieve the effect of high heat dissipation efficiency.

Inactive Publication Date: 2017-03-15
CHENGDU YIRUIXIN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The heat dissipation structure in the prior art does not have high heat dissipation efficiency, and at the same time, there may be heat recovery

Method used

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  • Electric power conversion device

Examples

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Embodiment 1

[0017] A power conversion device, comprising a box body 1 and a PCB board 9 on which a plurality of semiconductor devices 7 are installed, characterized in that it includes a plurality of heat-absorbing evaporation channels 8 arranged on the PCB board 9, and a plurality of semiconductor devices 7 are arranged and installed Between two pairs of heat-absorbing evaporation channels 8, a plurality of heat-absorbing evaporation channels 8 are combined and connected to one end of the refrigerant conduit 6, and the other end of the refrigerant conduit 6 is connected to the condensing part 2, and the installation position of the condensing part 2 is 9 positions higher than that of the PCB board. high.

[0018] Preferably, the refrigerant conduit 6 is a non-thermal conduction conduit. It is set as a heat-non-conductive pipe, so that the refrigerant that becomes vapor will not release heat to the inner space of the box before reaching the condensing part, thereby avoiding the return of ...

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Abstract

The invention discloses an electric power conversion device. The electric power conversion device comprises a box body and a PCB provided with a plurality of semiconductor devices, and is characterized in that the device comprises a plurality of heat absorption evaporation passages arranged on the PCB, wherein the semiconductor devices are arranged and mounted between every two heat absorption evaporation passages; the heat absorption evaporation passages are merged and then are connected with one end of a refrigerating fluid guide pipe; the other end of the refrigerating fluid guide pipe is connected with a condensing part; and the installation position of the condensing part is higher than the position of the PCB. The electric power conversion device has the effects of high heat dissipation efficiency, no backheat and no backflow.

Description

technical field [0001] The invention relates to the field of power supply, in particular to a power supply system with backup power. Background technique [0002] The power conversion devices of many electrical products have semiconductor devices, and through the switching action of the semiconductor devices, the power conversion is realized to achieve the purpose of power supply. Since such semiconductor devices generate heat due to switching operations, heat dissipation mechanisms such as heat sinks are required to dissipate heat from these semiconductor devices. The heat dissipation structures in the prior art do not have high heat dissipation efficiency, and at the same time, there may be heat recovery. Contents of the invention [0003] The object of the present invention is to provide a power conversion device which has the characteristics of high heat dissipation efficiency and no heat recovery, aiming at the problems existing in the prior art. [0004] In order t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K1/02
CPCH05K7/205H05K1/0209H05K7/20327
Inventor 昌越彬蒋明睿
Owner CHENGDU YIRUIXIN TECH CO LTD
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