A kind of preparation method of dam ceramic substrate for ultraviolet LED encapsulation

Abstract

The invention discloses a preparation method of a dam ceramic substrate for ultraviolet LED package. The preparation method includes the following steps that: (1) a plurality of independent lines are prepared on the surface of a ceramic substrate, wherein the independent lines are separated from one another at intervals, a plurality of through holes are formed in a dam substrate, the inner diameters of the bottom ends of the through holes are larger than the maximum width of the independent lines; (2) an adhesive layer coats the bottom surface of the dam substrate; (3) the adhesive layer is made to be sandwiched between the bottom surface of the dam substrate and the surface of the ceramic substrate; and (4) after the adhesive layer is solidified, the laminated and fixed ceramic substrate and dam substrate are cut, so that a finished product can be obtained. The independent lines are separated from the dam substrate, so that the independent lines will not contact with the dam substrate, and therefore, short-circuiting phenomena can be effectively eradicated; and an adhesive can be directly applied onto the bottom surface of the dam substrate, a user does not need to worry about poor positioning of the adhesive, automated operation can be favored, production efficiency can be effectively improved, and the yield of products can be improved.

Description

technical field [0001] The invention relates to the technology in the field of LED brackets, in particular to a method for preparing a dam ceramic substrate for ultraviolet LED packaging. Background technique [0002] For optical devices currently requiring airtight packaging, it is usually necessary to install a dam on the DPC ceramic substrate, and the space formed by the dam can be filled with packaging glue, so as to achieve better airtightness. In the prior art, insulating glue is usually used to paste and fix the dam substrate on the surface of the ceramic substrate covered with lines in advance. However, the groups of lines on the surface of the ceramic substrate are connected to each other, and the insulating glue covers the lines. This method will It is difficult to achieve a firm combination of the dam and the substrate, and because the dam is generally made of metal, if some glue is not good, the line will be connected to the dam, which will easily lead to a short...

AI Technical Summary

Problems solved by technology

[0003] In view of this, the present invention aims at the deficiencies in the prior art, and its main purpose is to provide a method for preparing a dam ceramic substrate for ultraviolet LED packaging, which can effectively solve the problem that the existing dam ceramic substrate preparation method cannot Issues with strong bonding to ceramic substrates and prone to short circuits

Images