Power module and vehicle with same

Abstract

The invention discloses a power module and a vehicle with the same. The power module comprises a shell, a power chip, a first heat radiation substrate and a second heat radiation substrate. An accommodation cavity is defined in the shell and is filled with insulation material. The first heat radiation substrate and the second heat radiation substrate are oppositely arranged. The power chip, the first heat radiation substrate and the second heat radiation substrate are all positioned in the accommodation cavity and are covered by the insulation material. The first heat radiation substrate and the second heat radiation substrate are arranged on the upper surface and the lower surface of the power chip respectively. A collector electrode is led out of the second heat radiation substrate, an emitting electrode is led out of the first heat radiation substrate, and a gate electrode is led out of the power chip. According to the power module provided by the embodiment of the invention, the upper and lower surfaces of the power chip achieve heat radiation at the same time, so that the heat radiation performance of the power module is greatly enhanced, thereby improving the reliability of the power module, and by arranging the insulation material in the shell, the effect of electrical insulation is achieved, devices in the shell are prevented from interference, and independent electrical features of each device are ensured.

Description

Technical field [0001] The present invention relates to the field of electronic manufacturing, and more specifically, to a power module and a vehicle having the same. Background technique [0002] With the national call for energy conservation and emission reduction, and the rapid development of pure electric vehicles and hybrid vehicles, high-power IGBT modules for electric vehicles are widely used. With the development of semiconductor technology and the requirements for product cost reduction, the power density requirements of the chips are getting higher and higher, and the volume requirements of the modules are getting smaller and smaller. Because the high-power IGBT modules for automobiles will generate more heat during operation, The junction temperature of the power chip rises. Power modules in related technologies generally use single-sided heat dissipation, such as coating thermal grease on the substrate of the IGBT module, installing it on the radiator, and using meta...

AI Technical Summary

Problems solved by technology

Power modules in the related art generally adopt a single-sided heat dissipation method, such as coating the substrate of the IGBT module with thermally conductive silicone grease, installing it on the radiator, and connecting it with metal bonding wires. When the module works under high temperature conditions for a long time , will cause the bonding wire to fall off and the module will fail

It can be seen that the single-sided cooling method cannot dissipate heat from the power module in a timely manner, which will greatly affect the performance of the power module, shorten the service life of the module, and even cause the module to burn out. Therefore, people put forward higher requirements for the heat dissipation of the power module.

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