The invention provides a wire for electronic components, comprising: a conductive substrate (1), a Sn alloy plating layer (2) of Sn and Bi, Cu, Ag or Sn and Zn covering its surface (front side), and forming a Zn alloy coating layer (2) on its upper layer. Plating layer, Ag plating layer, SnZn alloy plating layer, SnAg alloy plating layer, or upper layer plating layer of SnBi alloy plating layer (3). The concentration of Bi, Cu, Ag or Zn is set at 0.1 to 15% by weight, and the total thickness of the Sn alloy plating layer (2) and the upper layer plating layer (3) is set at 0.5 to 20 μm. Thereby, a lead wire for an electronic component having a tin-based plating layer, no toxic lead at all, low cost, and capable of reliably preventing whisker generation, and a flat cable composed of the lead wire are provided.