Unsealing method for flip chip device

Abstract

The invention discloses an unsealing method for a flip chip device. The method comprises the steps that a three-dimensional microscope is used for observing a device to be unsealed, and the appearance size, packaging thickness, packaging forms and packaging materials of the device to be unsealed are measured; one or more of a scanning acoustic microscope, a micro-focus X ray detector and a CT detector are selected to observe and record the device to be unsealed; the unsealing scheme of the device is determined according to the type of the device and the detecting results; embedding polishing or shell unsealing is used for carrying out unsealing pre-processing on the device to be unsealed; one or more of a mask etching method, a chemical etching method and a section microscopy method are used for carrying out chemical unsealing on the device to be unsealed; the interior technical parameters of the unsealed device are detected, evaluated and analyzed. Compared with a traditional unsealing method for a flip chip technology device, the unsealing method for the flip chip device has the advantages that the unsealing quality is greatly improved, and completeness and electrical characteristics of an unsealed silicon wafer are guaranteed.

Description

technical field [0001] The invention relates to the technical field of unsealing electronic devices, in particular to an unsealing method for flip-chip devices. Background technique [0002] At present, the devices that adopt the chip flip chip technology in the industry are mainly large-scale and ultra-large-scale integrated circuits in BGA packages and PGA packages. Due to its complex structure and the limitation of the existing unsealing method, the quality of unsealing cannot be guaranteed, which seriously affects the relevant tests after unsealing, and the electrical characteristics cannot be guaranteed. [0003] The existing unsealing method is to immerse the device in high-temperature acid to dissolve the external packaging materials (such as: molding compound, printed board, etc.), because the structure of the device using the flip-chip process is different from that of the traditional bonding process. The difficulty of unsealing is much greater than that of traditi...

AI Technical Summary

Problems solved by technology

Due to its complex structure and the limitation of the existing unsealing method, the quality of unsealing cannot be guaranteed, which seriously affects the relevant tests after unsealing, and the electrical characteristics cannot be guaranteed

[0003] The existing unsealing method is to immerse the device in high-temperature acid to dissolve the external packaging materials (such as: molding compound, printed board, etc.), because the structure of the device using the flip-chip process is different from that of the traditional bonding process. Its unsealing difficulty is much greater than that of traditional bonding process devices, the quality after unsealing cannot be guaranteed, the damage to the silicon wafer is greater, and it is impossible to observe the interlayer structure of the printed board

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