60results about How to "Solve the complex preparation process" patented technology

The present invention provides a method for manufacturing a 3D NAND storage device. By forming a stacked layer alternately stacked with sacrificial layers and insulating layers on a substrate, a channel hole and a storage device in the channel hole are formed in the first region of the stacked layer. layer, forming a covering layer on the stacked layer, wherein etching holes with different apertures are formed in the covering layer in the second region, and the covering layer is used as a shield to etch the stacked layer to form a contact hole under the etching hole, Different contact holes stop at different sacrificial layers. During the etching process, the larger the diameter of the etching hole, the greater the etching rate of the underlying stacked layer, so that the contact hole under the larger etching hole can have a deeper hole depth, thus achieving different depths of contact. The holes are etched to form contact holes corresponding to different sacrificial layers. For storage devices with multiple stacked layers, the complex manufacturing process and high cost caused by etching multi-layer steps are avoided, the area required for the device is reduced, and the yield rate of the wafer is improved.

The invention provides a metal powder modification solution, a modified metal powder, a preparation method of the modified metal powder and a metal micropowder-based paint. The metal powder modification liquid includes: phosphoric acid, phosphoric acid is calculated as H+, so that the pH value of the metal powder modification liquid is between 1.0 and 3.0; 0.1 to 1 weight part of passivation accelerator; and 75 to 100 weight parts of deionized water . The passivation film formed on the surface of the metal powder by using the above-mentioned metal modifying liquid can improve the corrosion resistance of the metal powder and the coating, and at the same time improve the adhesion between the metal powder and the coating and the substrate to be protected. When using the metal powder modifying solution to modify the metal powder, it is only necessary to mix the two and react under mild conditions, thereby solving the problem of complex preparation process of the metal-based micro-powder coating in the prior art.

The invention discloses an oil-equalizing control method for a compressor system and a multi-compressor parallel system. The method comprises the following steps: arranging N parallel rotor compressors; starting N1 compressors for simultaneously running; detecting phase angles of motor rotors of N1 compressors; judging if the phase angles of motor rotors of N1 compressors are consistent; if yes, running a conventional running control program for controlling the running of the N1 compressors; if not, adjusting the phase angles of motor rotors of N1 compressors and adopting the conventional running control program for controlling the running of the N1 compressors after the phase angles are consistent. According to the invention, the oil-equalizing problem between the compressors in the multi-compressor parallel system is solved; the phenomenon of compressor damage caused by long-term oil shortage of the compressors in the multi-compressor parallel system is avoided; the pipeline design is simplified; the problem of complex manufacturing technique caused by redundant pipelines is solved.

The present invention relates to the field of plastic forming and processing, specifically to a single mold one-step forming system and a single mold one-step forming method. The single mold one-step forming system of the present invention comprises: a host machine, wherein the host machine comprises a mold head; an auxiliary machine, wherein the auxiliary machine is positioned on the downstream of the host machine, comprises an auxiliary machine control system, a moveable frame and a drive system, wherein the moveable frame is provided with a lower mold and an upper mold, and can move along the guide rail of the auxiliary machine, the lower mold and the upper mold are provided for remaining upper and lower alignment. The single mold one-step forming method of the present invention comprises that: a prepared slice is guided and placed between the lower mold and the upper mold, wherein the upper mold and the lower mold remain the upper and lower alignment; the lower mold, the upper mold and the prepared slice move synchronously, the lower mold and the upper mold are closed and opened to enable the prepared slice to form the preset form. With the single mold one-step forming system and the single mold one-step forming method of the present invention, the problem of complex preparation process in the prior art can be solved, the occupied area and the equipment investment during the existing production process are substantially saved, the power consumption and the labor consumption are reduced.

The embodiment of the invention discloses a rotating structure and a preparation method thereof, the preparation method of the rotating structure comprises the following steps: preparing a slope unitby adopting an ion beam etching process, and the slope unit comprises a first slope surface and a second slope surface which are independently arranged; preparing first electrodes on the first slope surface and the second slope surface respectively; preparing a rotatable unit on one side of the slope unit; and preparing a second electrode, wherein the second electrode is electrically connected with the rotatable unit, and the rotatable unit is used for rotating according to electrostatic force between the first electrode and the second electrode. By the adoption of the technical scheme, the slope unit is prepared through the ion beam etching technology, the slope unit is easy to prepare, and the technical problem that in the prior art, the technology for preparing the slope unit through the multiple photoetching technologies is complex is solved; meanwhile, when the ion beam etching process is adopted for preparing the slope unit, the inclination angle of the slope unit can be very small, and the preparation flexibility of the slope unit is improved.