A slide table for rapid heat treatment equipment

A technology of rapid heat treatment and loading table, which is applied in the field of loading table, can solve the problems of unfavorable wafer process uniformity and consistency, prone to disturbance, complex structure, etc., to eliminate disturbance and vibration up and down, ensure process uniformity, Ensure accurate positioning

Active Publication Date: 2019-12-06
48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to improve the uniformity and consistency of the temperature and atmosphere during the wafer reaction process, the wafer needs to be kept rotating. The existing slide table is prone to disturbance and vibration during the rotation process, which will easily lead to inaccurate positioning of the wafer, which is not conducive to the overall stability of the wafer. Process uniformity and consistency
In addition, the structure of the moving parts of the existing slide table is complex, and the friction between the moving parts tends to produce particles, which affects the cleanliness of the process chamber

Method used

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  • A slide table for rapid heat treatment equipment
  • A slide table for rapid heat treatment equipment

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Embodiment Construction

[0021] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0022] like figure 1 and figure 2 As shown, the wafer stage used for rapid thermal processing equipment in this embodiment includes a wafer support assembly 2 and a drive assembly for driving the wafer support assembly 2 to rotate. The wafer support assembly 2 includes a support cylinder 21 and a wafer support ring 22 to support The cylinder 21 is arranged on the driving assembly and the cylinder wall at the upper end is pointed. The lower surface of the wafer support ring 22 is provided with an inverted V-shaped limiting ring groove 221 , and the upper end of the supporting cylinder 21 is embedded in the V-shaped limiting ring groove 221 . The wafer stage used for rapid heat treatment equipment uses a wafer support ring 22 to support the wafer 9, and uses a support cylinder 21 to support the wafer support ring 22. The support cylin...

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Abstract

The invention discloses a slide holder applied to a fast heat treatment device. The slide holder comprises a wafer support assembly and a drive assembly used for driving the rotation of the wafer support assembly. The wafer support assembly comprises a support cylinder and a wafer carrier ring. The support cylinder is arranged on the drive assembly, and the upper cylinder wall is pointed. An inverted V-shaped limit ring groove is arranged on the lower surface of the wafer carrier ring. The upper end of the support cylinder is embedded into the V-shaped limit ring groove. The slide holder provided by the invention has the advantages of simple structure, accurate wafer positioning, uniform process, good consistency and the like.

Description

technical field [0001] The invention relates to rapid heat treatment equipment used in semiconductor manufacturing process, in particular to a chip loading table used for rapid heat treatment equipment. Background technique [0002] Rapid thermal processing (hereinafter referred to as RTP) process is to reduce the thermal budget of the process by shortening the time that the wafer stays in the thermal field through rapid temperature rise. RTP technology was originally developed for the annealing process after ion implantation, but due to its very fast heating and cooling The advantages of high speed, shorter process time and smaller cavity volume have been widely used in advanced semiconductor manufacturing processes, and have become the mainstream technology for deep submicron semiconductor wafer heat treatment processes. It is used for ultra-shallow junction advanced The advantages of device and large-size wafer manufacturing process are more obvious. The key applications ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/687
CPCH01L21/67098H01L21/68785
Inventor 钟新华胡振东易文杰袁卫华彭立波许波涛
Owner 48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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