Substrate processing heater device and substrate solution processing device having same

Abstract

The present invention relates to a substrate processing heater device for heating a substrate so as to process the substrate, and a substrate solution processing device having the same, comprising: a heater part formed to have an opposite surface of a size greater than or equal to a processing surface size of a substrate, thereby heating the substrate; and a lamp part having a plurality of lamp units arranged to be adjacent to each other on the opposite surface of the heater part. Therefore, the present invention enables an opposite surface of a heater part to be formed of a size greater than or equal to a processing surface size of a substrate and a plurality of lamp units to be arranged adjacently to each other on the opposite surface, thereby providing an effect of preventing non-uniform processing for a processing surface of a substrate by uniformly maintaining a heating temperature on the processing surface of the substrate, such that the processing efficiency of the substrate can be improved.

Description

technical field [0001] The present invention relates to a substrate processing heating device and a substrate liquid processing device provided therewith, more specifically, a substrate processing heating device for heating a substrate for processing a substrate and measuring the temperature of the substrate, and a substrate liquid processing device provided therewith. Background technique [0002] In order to manufacture semiconductor devices, etching and cleaning processes are necessary when forming multilayer thin films on substrates. [0003] Substrate liquid processing devices such as single-chip wet etching and cleaning devices supply the processing liquid to the substrate by rotating the table with the chuck supporting the substrate, and perform etching, cleaning, and drying processes. The treatment liquid recovery unit recovers the treatment liquid. [0004] In addition, when removing a thin film such as a nitride film, an oxide film, a metal film or photoresist dep...

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Problems solved by technology

[0005] In particular, in the conventional heater-type substrate liquid processing apparatus using a heating device, since the size of the heater is smaller than the size of the processing surface of the substrate, the heating temperature of the processing surface of the substrate is uneven, which becomes the cause of poor processing during substrate liquid processing.

[0006] Moreover, if the heaters are arranged in a fixed arrangement on the processing surface of the substrate, the heating range of the heaters is the same or overlapped, or repeated in double or triple, resulting in uneven heating temperature on the substrate processing surface.

[0007] Moreover, in order to solve the uneven heating temperature on the substrate processing surface, it is necessary to control the intensity of the heater, but it is not easy to detect the uneven heating temperature of the substrate, and it is difficult to control the intensity of the heater according to the heating temperature of the substrate.

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