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Printed wiring board

A printed wiring board and wiring technology, applied in the directions of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of difficult to form shielding, high shielding structure, etc., and achieve the effect of high shielding

Inactive Publication Date: 2017-04-19
THE FUJIKURA CABLE WORKS LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In such a printed wiring board, it is necessary to adopt a structure in which the pads in contact with the connector are exposed on the surface, so there is a problem that it is difficult to form a shielding structure with high shielding performance.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0258] As Example 1, the model 1 of the printed wiring board 1 of the said 2nd example was defined. The model 1 of the printed wiring board 1 of the second example has Figure 2A ~ Figure 2Fconstruction shown. Moreover, in order to compare with Example 1, the model 1-2 of the printed wiring board which concerns on the comparative example 1 was defined. Model 1-2 of Comparative Example 1 was defined under the same conditions as Model 1 of Example 1 except for not having the groove 4 surrounding the pads 2a and 2b.

[0259] Such as Figure 9A As shown, the ground layer 3 is formed around the lands 2 a and 2 b of the model 1 of the printed wiring board 1 according to the first embodiment, and the groove 4 is formed between the lands 2 a and 2 b and the ground layer 3 . On the other hand, in the printed wiring board model 1-2 according to Comparative Example 1, no ground layer was formed around the pads (members corresponding to the pads 2a and 2b of this embodiment, the same b...

Embodiment 2

[0262] As Example 2, the model 2 of the structure which formed the ground layer 3 in the other main surface of the printed wiring board 1 of the said 2nd example was defined. The number of layers of the conductive layer of the printed wiring board of the model 2 of Example 2 was two layers. A ground layer is formed on one of the other main surfaces of the insulating base material. Moreover, in order to compare with this Example 2, the model 2-2 of the printed wiring board which concerns on the comparative example 2 was defined. Model 2-2 of Comparative Example 2 was tested under the same conditions as Model 2-1 of Example 2, except that the ground layer surrounding the entire circumference of the pad was not formed on one main surface of the insulating base material. defined.

[0263] Such as Figure 9A As shown, the model 2 of the printed wiring board 1 according to Example 2 has the groove 4, but the printed wiring board according to the model 2-2 of the comparative examp...

Embodiment 3

[0266] As Example 3, the model 3 of the printed wiring board 1 of the above-mentioned eighth example is defined. The number of layers of the conductive layer of the printed wiring board of model 2 was three layers. On one main surface of the insulating base material, a ground layer is not provided at a position closer to the connection end E side than the pad, and a ground layer is provided only on the side opposite to the connection end E. The model 3 of the printed wiring board 1 of the eighth example has Figure 8A ~ Figure 8H construction shown. Moreover, in order to compare with the model 3 of this Example 3, the model 3-2 of the printed wiring board which concerns on the comparative example 3 was defined. Model 3-2 of Comparative Example 3 was defined under the same conditions as Model 3 of Example 3 except that it did not have groove 4 surrounding pads 2a and 2b.

[0267] Such as Figure 9B As shown, the mold 3 of the printed wiring board 1 according to Example 3 ha...

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PUM

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Abstract

Provided is a printed wiring board (1) including at least a first substrate (11) in which pads (2), which are electrically connected to other connectors, and ground layers (3), which enclose the pads (2) from around the pads (2), are formed on any one of the main surfaces; the ground layers (3) being connected to a ground contact and being formed so as to have an inner edge set apart from the outer edge of the pads (2) by a predetermined distance. Trenches (4) are formed between the pads (2) and the ground layers (3).

Description

technical field [0001] The present invention relates to a printed wiring board connected to other electronic components included in electronic equipment. [0002] For the designated country that recognizes the incorporation by reference, the content described in Japanese Patent Application No. 2014-192485 filed in Japan on September 22, 2014 is incorporated by reference into this specification as the description of this specification part. Background technique [0003] A printed wiring board is known which is a flexible printed wiring board connected to other electronic devices via a connector, and is formed by providing a film on the lower surface side of a base film. First wiring and a structure in which the second wiring is provided on the upper surface side of the base film 52 . [0004] Patent Document 1: Japanese Patent Laid-Open No. 2009-080972 [0005] In such a printed wiring board, it is necessary to adopt a structure in which pads in contact with the connector ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K1/02
CPCH05K1/0221H05K1/0245H05K1/0298H05K1/117H05K1/118H05K2201/09363H05K1/111H05K1/115H05K1/0216H05K1/0218H05K3/22H05K3/4644H05K2201/09236
Inventor 石田悠起铃木雅幸浦井元德小岛功
Owner THE FUJIKURA CABLE WORKS LTD
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