Self-repair re-molded multi-deformation thermosetting shape memory resin material and preparation method thereof

A resin material and self-healing technology, which is applied in the field of shape memory functional high-performance resin matrix, can solve the problems of micro-crack damage, inability to effectively realize complex shape deformation, memory resin cannot be reshaped, etc., and achieve stable shape memory performance , excellent heat resistance, the effect of many recovery cycles

Active Publication Date: 2017-04-26
南通雅瑞新材料科技有限公司
View PDF3 Cites 30 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented inventor describes different types of plastics used for making objects like automobiles or boats. These plastings have unique properties such as being able to recover their original shapes even if they are damaged during manufacturing processes. They also allow for easy reuse without having to dispose of them afterwards due to their own healability features. Additionally, these polymers exhibits strong thermal insulation capabilities which makes them ideal candidates for creating better structures made from those materials. Overall, these innovations make managing multiple forms of plasms faster and easier compared to previous methods.

Problems solved by technology

Technological Problem: Current commonly used thermotropic liquid crystal elastometers lack versatility due to changes in chemical structure caused by environmental factors like humidity and pressure. Additionally, current methods require expensive equipment and complicated processes making them difficult to use outside specialized industries where strict requirements exist.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Self-repair re-molded multi-deformation thermosetting shape memory resin material and preparation method thereof
  • Self-repair re-molded multi-deformation thermosetting shape memory resin material and preparation method thereof
  • Self-repair re-molded multi-deformation thermosetting shape memory resin material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032]Dissolve 5g of bismaleimidodiphenylmethane (BMI) and 4g of 4,4'-diaminodiphenylsulfone in acetone in a cooling reflux device, and react at a controlled temperature of 60°C for 12 hours under stirring conditions , the solution was removed by rotary evaporation to remove the acetone solvent, and then vacuum-dried at 70° C. for 12 hours to obtain bismaleimide / aromatic diamine oligomer powder. Add the oligomer to 75g of epoxy resin (E-54), melt into a transparent solution at 100°C, add 4g of accelerator zinc acetylacetonate, stir for about 3 minutes, then add 12g of glutaric anhydride, stir quickly and mix well Finally, it is poured into a flat mold, and after vacuum defoaming at 110°C, it is treated according to the curing process 110°C / 1h+140°C / 8h+160°C / 2h, and the cured material is taken out after natural cooling.

[0033] figure 1 It is a diagram of the transesterification reaction and crack repair mechanism. In the material of the present invention, under the condition...

Embodiment 2

[0040] Dissolve 13g of bismaleimidodiphenylmethane (BMI) and 9g of 4,4'-diaminodiphenylsulfone in acetone in a cooling reflux device, and react at a controlled temperature of 70°C for 12 hours under stirring conditions , the solution was removed by rotary evaporation to remove the acetone solvent, and then vacuum-dried at 70° C. for 12 hours to obtain bismaleimide / aromatic diamine oligomer powder. Add the oligomer to 100g of epoxy resin (E-51), melt into a transparent solution at 100°C, add 6.7g of accelerator zinc acetylacetonate, stir for about 3 minutes, then add 15g of glutaric anhydride, stir and mix quickly After uniformity, it is poured into a flat mold, and after vacuum defoaming at 110°C, it is treated according to the curing process 110°C / 1h+140°C / 8h+160°C / 2h, and the cured material is taken out after natural cooling.

[0041] Figure 4 is the shape memory cycle curve (DMA test) of the material of Example 2. The glass transition temperature of the prepared material...

Embodiment 3

[0044] After dissolving 25g of bismaleimide diphenyl ether and 18g of 4,4'-diaminodiphenyl ether in acetone in a cooling reflux device, under stirring conditions, the temperature was controlled at 70°C for 12 hours, and the After the acetone solvent was removed by rotary evaporation, the solution was vacuum-dried at 70° C. for 12 hours to obtain bismaleimide / aromatic diamine oligomer powder. Add the oligomer to 120g of novolac epoxy resin (F-51), melt it into a transparent solution at 100°C, add 8g of accelerator zinc acetylacetonate, stir for about 5 minutes, and then add 18g of hexahydrophthalo Acid anhydride, after stirring quickly and mixing evenly, pour it into a flat mold, after vacuum defoaming at 110°C, treat it according to the curing process 110°C / 1h+140°C / 8h+160°C / 2h, and take out the solidified material after natural cooling.

[0045] Figure 6 is the shape memory cycle curve (DMA test) of the above materials. The glass transition temperature of the prepared mate...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Glass transition temperatureaaaaaaaaaa
Fracture toughnessaaaaaaaaaa
Glass transition temperatureaaaaaaaaaa
Login to view more

Abstract

The invention discloses a self-repair re-molded multi-deformation thermosetting shape memory resin material and a preparation method thereof. Mainly with bismaleimide, aromatic diamine, epoxy resin, dicarboxylic anhydride and an ester exchange accelerant as raw materials, the re-molded multi-deformation thermosetting shape memory resin material, which has a self-repair function, is prepared by conducting a chain-elongation reaction on the bismaleimide resin by virtue of the aromatic diamine so as to form a linear oligomer, then adding the epoxy resin, the accelerant and the dicarboxylic anhydride, and conducting a certain thermosetting process. The material prepared by the invention can be re-molded into a new shape, and the material, even undergoing reciprocating deformation cycles for more than 5 times, can still guarantee a good shape memory effect; and moreover, the prepared material has a good self-repair capacity, and a fracture toughness repair efficiency can reach 62% or above. Therefore, the prepared material has a broad application potential high-performance structural function integrated materials.

Description

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Owner 南通雅瑞新材料科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap