Chip monitoring device and method for flip-chip process

Abstract

The invention discloses a chip monitoring device and a chip monitoring method for a chip upside-down mounting process. The method comprises the following steps: the feature point image information of a bumped chip is preloaded to a control computer; the bumped chip is inverted and mounted on a chip surface mounting head by adsorption; the control computer sends a control signal according to the position information of a mobile mechanism and the chip surface mounting head to make the chip within the visual range of a shooting device, wherein the camera of the shooting device focuses on the tested bumped chip; the image information of the bumped surface of the bumped chip is acquired, the feature points in the image information are identified, a motion control signal is sent to the mobile mechanism, and the position of the chip surface mounting head is adjusted to make the feature points fit a preset feature point image; the bumped surface image information shot at the moment is stored; and whether the chip is usable is judged, and the judgment result is output and displayed. It is ensured that chips used in a chip upside-down mounting process are good. The use of bad chips, such as damaged chips and chips with damaged balls, is reduced. The control power for raw materials of devices is improved significantly.

Description

technical field [0001] The invention relates to a chip monitoring device and method for chip flip chip technology, which is suitable for flip chip flip chip technology process. Background technique [0002] Flip-chip technology is one of the important factors affecting the quality of flip-chip products. However, due to the characteristics of the flip-chip packaging process, the chip needs to be flipped and then mounted on the ceramic substrate. Point surface observation cannot guarantee the surface state of chips and bumps before flip-chip welding, and due to the characteristics of flip-chip packaging circuit bump surface array arrangement, it is impossible to directly perform visual inspection of solder joints after reflow soldering. The method is to inspect the chips and solder joints before flipping the chips, and carry out the follow-up process if the inspection is good. However, if the chip or the bump is damaged during the chip flipping process, the damage in this pro...

AI Technical Summary

Problems solved by technology

[0002] Flip-chip technology is one of the important factors affecting the quality of flip-chip products. However, due to the characteristics of the flip-chip packaging process, the chip needs to be flipped and then mounted on the ceramic substrate. Point surface observation cannot guarantee the surface state of chips and bumps before flip-chip welding, and due to the characteristics of flip-chip packaging circuit bump surface array arrangement, it is impossible to directly perform visual inspection of solder joints after reflow soldering. The method is to inspect the chip and solder joints before flipping the chip, and carry out the follow-up process if the inspection is good.

However, if the chip or the bump is damaged during the chip flipping process, the damage in this process cannot be found, so there is a certain hidden danger

In addition, the traditional chip flip-chip equipment has the functions of mounting and welding, but does not have the function of observing and recording the chip process. If the circuit fails later, the original state of the chip and bumps cannot be traced, making it difficult to locate the failure problem.

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