Micro-channel aluminum vapor chamber

Abstract

The invention provides a micro-channel aluminum vapor chamber. The vapor chamber comprises a collecting pipe. Several tube plates which are arranged with intervals are arranged in the collecting pipe along a length extension direction. The tube plates are provided with microchannels. A phase transition working medium is arranged in the collecting pipe. The vapor chamber is characterized in that an inner wall of the collecting pipe is provided with a grooved capillary structure; the grooved capillary structure and the collecting pipe form one piece; the grooved capillary structure surrounds the tube plates; the tube plates are aluminum plates; and a capillary suction liquid core is arranged on each tube plate. By using the micro-channel aluminum vapor chamber, a horizontal direction heat transfer effect is not influenced and simultaneously a temperature difference at an inverse gravity direction can be controlled within 5 degree; and meanwhile, a low temperature icing problem is solved, and the vapor chamber can be normally used in a low temperature environment of minus 40 DEG C-minus 80 DEG C.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation and heat conduction, and in particular relates to a microchannel aluminum soaking plate. Background technique [0002] With the development of technology, the integration scale of electronic components is getting larger and larger, and the heat generated per unit volume is also increasing. At the same time, the available effective heat dissipation area is getting smaller and smaller, and the heat dissipation problem has become a constraint. An important factor in the scale of integration of electronic components. The copper heat pipe is an efficient and reliable two-phase passive heat conduction device, which uses the phase change of the working fluid to transfer heat. Its high stability and efficient heat dissipation make it widely used in the field of heat dissipation. However, with the increase in the price of non-ferrous metals and the improvement of thermal management requirements, ...

AI Technical Summary

Problems solved by technology

However, with the increase in the price of non-ferrous metals and the improvement of thermal management requirements, the traditional copper heat pipe heat dissipation method has certain limitations in terms of cost and resource utilization. The micro-channel hot plate is a staggered and stacked micro-channel network structure processed on the tube sheet. The channel width and channel wall thickness are about 50um, and the channel aspect ratio is about 10. The phase-change working medium circulates in the micro-channel to conduct heat.

At present, most of the microchannel hot plates on the market have no anti-gravity, and only have heat transfer advantages in the horizontal direction. In the anti-gravity direction, there is basically no heat transfer effect, and the temperature difference is generally above 15°; on the other hand, currently Most of the microchannel hot plates use water as the phase change working medium, and the water will freeze below zero, so it cannot be used in the low temperature environment. Many technical problems above have to be solved

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