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Blanking female die cavity clamping groove machining method

A processing method and slotting technology, which are applied in the processing field of lead frame cemented carbide grade molds, can solve the problems of large burrs, products that do not meet the requirements, and cannot meet the requirements of use, etc., and achieve the effect of increasing friction.

Active Publication Date: 2017-05-10
NINGBO KANGQIANG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Using this method to add small grooves to the cavity due to the designed shape and depth is relatively small, and sometimes fails, and cannot completely suppress chip jumping, chip turning, etc., but designing a larger shape will result in gaps or burrs in the punched product The phenomenon is too large, and the product does not meet the requirements at this time
[0003] Therefore, wire cutting is used to process oblique grooves on the die, so that the round cavity groove of the die can more effectively suppress the phenomenon of waste chip jumping, chip turning, and chip blocking. The invention patent with the patent number 201511007116.9 discloses a Lead frame mold and its working method, wherein the groove is an oblique linear groove, but this groove is not a real "spiral groove" along the circumferential direction, which cannot meet the requirements of use

Method used

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  • Blanking female die cavity clamping groove machining method
  • Blanking female die cavity clamping groove machining method
  • Blanking female die cavity clamping groove machining method

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] The integral die in the mold of our company's product SOT-23J(6R) requires the die slope to be b=0.17°, and the slope of the K method to be a=0.33°;

[0048] The distance from the upper head of the machine tool to the machine table top is A=30mm, the distance from the lower head of the machine tool to the machine table top is B=15mm, and the distance from the machine table top to the workpiece surface C=10mm;

[0049] Calculated as follows:

[0050] U=tan(a)*(A+B)=tan(0.33°)*(30+15)≈0.259mm;

[0051] X=-tan(a)*(C+B)=tan(0.33°)*(10+15)≈-0.144mm;

[0052] V=tan(b)*(A+B)=tan(0.17°)*(30+15)≈0.134mm;

[0053] Y==-tan(b)*(C+B)=tan(0.17°)*(10+15)≈-0.074mm;

[0054] First, process the circular cavity according to the slow wire-feeding machine tool, and then process the K method according to the above method according to the calculated value.

Embodiment 2

[0056] The integral die in the mold of our company's product SOT-23E6(F6) requires the die slope to be b=0.2°, and the slope of the K method to be a=0.33°;

[0057]The distance from the upper head of the machine tool to the machine table top is A=35mm, the distance from the lower head of the machine tool to the machine table top is B=15mm, and the distance from the machine table top to the workpiece surface C=15mm;

[0058] Calculated as follows:

[0059] U=tan(a)*(A+B)=tan(0.33°)*(35+15)≈0.288mm;

[0060] X=-tan(a)*(C+B)=tan(0.33°)*(15+15)≈-0.173mm;

[0061] V=tan(b)*(A+B)=tan(0.2°)*(35+15)≈0.175mm;

[0062] Y==-tan(b)*(C+B)=tan(0.2°)*(15+15)≈-0.105mm;

[0063] First, process the circular cavity according to the slow wire-feeding machine tool, and then process the K method according to the above method according to the calculated value.

Embodiment 3

[0065] The overall die of our company's product SOT-23, 6L (12R) mold requires the die slope to be b=0.1°, and the slope of the K method to be a=0.33°; the card is processed at the midpoint of the three sides of the triangle in the figure Slot, the three card slots form a circle.

[0066] The distance from the upper head of the machine tool to the machine table top is A=40mm, the distance from the lower head of the machine tool to the machine table top is B=15mm, and the distance from the machine table top to the workpiece surface C=20mm;

[0067] Calculated as follows:

[0068] U=tan(a)*(A+B)=tan(0.33°)*(40+15)≈0.317mm;

[0069] X=-tan(a)*(C+B)=tan(0.33°)*(20+15)≈-0.202mm;

[0070] V=tan(b)*(A+B)=tan(0.1°)*(40+15)≈0.096mm;

[0071] Y==-tan(b)*(C+B)=tan(0.1°)*(20+15)≈-0.061mm;

[0072] First, process the circular cavity according to the slow wire-feeding machine tool, and then process the K method according to the above method according to the calculated value.

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Abstract

The invention relates to a blanking female die cavity clamping groove machining method. The method is characterized by comprising the steps that operation is conducted by adopting a low-speed wire feeding linear cutting machine tool, wherein multiple to-be-machined clamping grooves located in a blanking female die cavity are evenly arranged and located on the circumference of a same circle with the radius of R, and the first clamping groove is machined firstly; a U value, an X value, a V value and a Y value are calculated according to trigonometric functions, position adjusting is conducted on an upper machine tool handpiece and a lower machine tool handpiece after data of the above-mentioned X value, Y value, U value and V value is calculated, and then the first clamping groove is machined; coordinate rotation is conducted on a compiled program according to the position relations between other clamping grooves and the first clamping groove, and then other clamping grooves are machined. According to the blanking female die cavity clamping groove machining method, the machined clamping grooves are approximate to spiral grooves, and therefore the frictional force of waste chips in the female die circular cavity is mutually restricted; meanwhile, the frictional force is greatly increased, and therefore the chip jumping and turning phenomena of the waste chips in the cavity are powerfully guaranteed.

Description

technical field [0001] The invention relates to a processing method for punching concave mold cavity slots, which is mainly used for processing lead frame hard alloy grade molds. Background technique [0002] In the production process of cold stamping dies, there are often phenomena such as waste chip jumping, chip turning, and chip blocking, which not only affect the surface quality of the product, but also greatly affect the production efficiency of the product. How to suppress the phenomenon of waste material jumping, chip turning and chip blocking, and reduce its impact on product quality has always been a problem to be solved in the punching process. Among them, especially the cavities with relatively simple shapes in the blanking production process of integrated circuit lead frames, such as circular or rectangular cavities, are very easy to skip chips and turn chips. In order to make the waste material complex in shape and effectively suppress the upward jump of the w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23H7/06
CPCB23H7/06
Inventor 谢艳孙华吴旺春倪杰
Owner NINGBO KANGQIANG ELECTRONICS CO LTD