A kind of flexible thermal conductive resin for metal-based copper clad laminate
A thermally conductive resin and flexible technology, applied in the field of various circuit board materials, can solve the problem of not greatly improving the performance, and achieve the effect of improving the service life, strong bonding performance and excellent thermal conductivity.
Active Publication Date: 2019-03-05
CYBRID TECHNOLOGIES INC
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Problems solved by technology
But in fact, its measured performance has not been greatly improved compared with the comparative example, and there should still be a large room for improvement
Method used
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Embodiment 1-7
[0018] Embodiment 1-Embodiment 7 respectively provide a kind of flexible thermally conductive resin for metal-based copper-clad laminates, and their specific composition and content (mass percentage) are listed in Table 1 (the raw materials selected in these embodiments are conventional in this field. raw materials, those skilled in the art can select other types of raw materials of the same type as required, which has less impact on the performance of the final product).
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The invention relates to flexible heat-conducting resin for a metal-based copper-cladded plate. The flexible heat-conducting resin is prepared from the following components in percentage by mass: 10 percent to 60 percent of epoxy resin, 5 percent to 50 percent of a thermoplastic elastomer, 1 percent to 10 percent of a curing agent, 0.1 percent to 5 percent of a catalyst, 0.1 percent to 5 percent of a coupling agent and 10 percent to 50 percent of aluminum oxide, wherein the coupling agent is a mixture of a silane coupling agent and one or more selected from a titanate coupling agent, a chromium complex coupling agent, an aluminum-zirconium coupling agent, a magnesium coupling agent and a thin coupling agent; the mass percent of the silane coupling agent in the coupling agent is 50 percent to 80 percent. By adjusting the proportion of formula components and adopting the specific coupling agent, the flexible heat-conducting resin has excellent heat-conducting and insulating performance and high flexibility and adhesive performance; the service life can be prolonged.
Description
technical field [0001] The invention belongs to the field of circuit board materials, and relates to a thermally conductive resin, in particular to a flexible thermally conductive resin for metal-based copper-clad laminates. Background technique [0002] Copper-clad laminate (full name copper-clad laminate, English abbreviation CCL) is a product made of wood pulp paper or glass fiber cloth as a reinforcing material, impregnated with resin, covered with copper foil on one or both sides, and hot-pressed. . Copper clad laminate is the basic material of the electronics industry. It is mainly used for processing and manufacturing printed circuit boards (PCBs), and is widely used in electronic products such as televisions, radios, computers, computers, and mobile communications. [0003] According to its insulating material and structure, copper clad laminates are divided into organic resin copper clad laminates, metal based copper clad laminates and ceramic based copper clad lam...
Claims
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IPC IPC(8): C08L63/00C08L9/02C08K5/5435C08K3/22C09K5/14
CPCC08L9/02C08L63/00C08L2203/20C09K5/14C08K5/5435C08K2003/2227
Inventor 陈洪野高畠博宇野敬一吴小平邓建波
Owner CYBRID TECHNOLOGIES INC