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Inductive device and interleaved parallel direct current converter

A technology of DC converters and inductors, applied in the field of circuits, can solve problems such as the miniaturization of unfavorable inductor devices

Active Publication Date: 2017-05-10
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Taking the coupled inductor as an example, the two inductors included in the existing coupled inductor are arranged in parallel, which is not conducive to the miniaturization of the inductor device

Method used

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  • Inductive device and interleaved parallel direct current converter
  • Inductive device and interleaved parallel direct current converter
  • Inductive device and interleaved parallel direct current converter

Examples

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Embodiment Construction

[0051] The technical solution in this application will be described below with reference to the accompanying drawings.

[0052] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0053] It should be understood that the inductance device in the embodiment of the present application may be applied to an interleaved parallel DC converter, and may also be applied to other circuits or structures, which is not limited in the present application.

[0054] It should also be understood that the i-th (i=1, . . . , N, N≥1) conductive layer and the j-th (j=1, . The names of components shall not constitute any limitation to this application.

[0055] The inductance device in the embodiment of the present application may at least include the following two situations:

[0056] Case 1: The inductance device is used to form a single inductance (t...

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PUM

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Abstract

The embodiment of the invention provides an inductive device and an interleaved parallel direct current converter. The inductive device occupies a small volume and / or area of a substrate, thereby facilitating the miniaturization and low cost requirements of the inductive device. The inductive device comprises a first inductive unit and a second inductive unit, wherein the first inductive unit comprises a first conductive connection member and a first conductive layer, the first conductive connection member is connected with the first conductive layer, and first through holes are formed in the first conductive layer; the second inductive unit comprises a second conductive layer and a second conductive connection member, and the second conductive layer is connected with the second conductive connection member; and the second conductive connecting member is embedded and inserted into the first conductive connecting member through the first through holes to form a coaxial structure, and the projection of the first conductive layer of the first inductive unit and the projection of the second conductive layer of the second inductive unit on the first plane are at least partially overlapped.

Description

technical field [0001] The embodiments of the present application relate to the circuit field, and more specifically, relate to an inductance device and an interleaved parallel DC converter. Background technique [0002] High frequency is the key technical means to reduce the size and weight of power supply devices. With the increase of switching frequency of power supply devices, the size of circuit devices such as inductance devices and capacitors is continuously reduced, and inductance devices are beginning to be integrated from discrete independent components to on-chip packaging. Development, the use of integrated inductors can reduce the size of the power supply device and increase the power density of the power supply device. The inductance device may include an inductor, a coupled inductor composed of two inductors, and the like. The volume and / or area occupied by the inductance device in the prior art is still relatively large. Taking inductance as an example, the...

Claims

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Application Information

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IPC IPC(8): H01F27/28H01F37/00H01F38/14H02M3/04
CPCH01F27/28H01F37/00H01F38/14H02M3/04H02M1/0064
Inventor 蔡锦森朱勇发骆孝龙
Owner HUAWEI TECH CO LTD
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