High-strength alloy-containing polishing head of cmp apparatus

Abstract

The present invention relates to a high-strength alloy-containing polishing head of a CMP apparatus that can fundamentally prevent cracks of a ceramic material by improving the structure of a circular perforated plate constituting the polishing head and replacing the material thereof with a high-strength special alloy so that it is possible to extend a lifetime of a product and to maximize an operating ratio of equipment, thereby significantly enhancing production efficiency. The polishing head of a CMP apparatus comprises a pressure adjusting device (11), an attraction part (12), a circular perforated plate (100), and a retainer ring (13), wherein the perforated plate (100) includes: a main body (110) having the shape of a circular plate; a pair of alignment recesses (111) (111) formed in the center of the upper portion of the main body (110) to be symmetric to each other; a plurality of holes (112) formed in the main body (110); four through-holes (113) formed on a side of the main body (100); a central recess (114) formed in the center of the rear surface of the main body (110); a ball (115), a portion of which is fixedly inserted into the center of the central recess (114); a circular metal plate (116) that is installed to be fixedly inserted into the central portion of the central recess (114) and has an exposure hole (116a) formed therein through which a portion of the ball (115) is exposed; a plurality of balancing pins (117) fixedly inserted into the periphery of the central recess (114); and upper and lower peripheral portions (120) (130) fixed to surround the periphery of the main body (110), and the metal plate (116) is formed of a special alloy that contains zirconium, titanium, nickel, and chromium.

Description

technical field [0001] The present invention relates to the polishing head of chemical mechanical polishing (CMP,Chemical MechanicalPolishing) device used in the manufacture of semiconductor components, more particularly to a kind of polishing head comprising the CMP device of high-strength alloy, improving the structure of the circular perforated plate forming the polishing head, Replace the material with a high-strength special alloy to fundamentally prevent cracks in the ceramic material, thereby prolonging the life of the product, and at the same time, greatly improving the operating rate of the equipment, thereby greatly improving production efficiency. Background technique [0002] Recently, with the high integration of semiconductor devices, the wiring structure has been multi-layered, and surface faults between unit cells stacked on the semiconductor substrate have increased. Therefore, it is very important to find a technique for planarizing the surface faults. [...

AI Technical Summary

Problems solved by technology

[0015] But, existing balance pin (38) such as image 3 As shown in (b), the fixing part (38a) at the lower end of the balance pin (38) is attached and fixed to the central groove part (36) by a special adhesive, and as time goes by, the adhesive solidifies and powder The phenomenon of random flying has caused a serious and bad impact on the polishing process

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