RGBLED (Red Green Blue Light Emitting Diode) structure and preparation process

Abstract

The invention discloses an RGBLED (Red Green Blue Light Emitting Diode) structure. The RGBLED structure comprises a shell, chips, guide wires, a glue layer, bracket pins, polar posts and a conducting layer, wherein the bracket pins are inserted at the four corners of the shell; the chips are arranged in the shell and are connected by the guide wires; and the polar posts are fixedly arranged on the conducting layer. A preparation process comprises the following steps: step (1) fixed installation of the chips; step (2) connection of the chips; step (3) fixed package of the chips; step (4) peeling of resin sheets; step (5) bonding of the conducting layer and the polar posts; step (6) removal of the conducting layer; and step (7) cutting and molding. According to the RGBLED structure and the preparation process disclosed by the invention, the smallest size of a product can be achieved, the reliability of the product is enhanced, the cost is reduced and the pollution is alleviated.

Description

technical field [0001] The invention relates to the technical field of RGB lamp beads, in particular to an RGB LED structure and a preparation process. Background technique [0002] RGB lamp beads are three kinds of chips, red, green and blue, which are glued to the bracket through glue. (Because the commonly used red light chip has only a single polarity on one side, the glue for bonding it is conductive glue. In addition to bonding, it can also be used In order to conduct electricity; for blue and green, according to the application site and requirements, both insulating glue and conductive glue may be used, and then connect the electrode of the chip and the bracket through the lead, and finally inject glue into the bracket to protect the chip and lead. [0003] In the prior art, the RGBLED structure and preparation process have the following deficiencies: [0004] 1: The production cycle is long; [0005] 2: The equipment cost is high; [0006] 3: The cost is higher af...

AI Technical Summary

Problems solved by technology

[0004] 1: Long production cycle;

[0005] 2: High equipment cost;

[0006] 3: The cost of the product is higher after miniaturization;

[0007] 4: The production process of the bracket will produce electroplating pollution;

[0008] 5: The reliability is relatively poor (the main reason for the failure of the lamp bead is the defect caused by the welding wire);

[0009] 6: The degree of automation of a single process is very high, but automatic connection cannot be realized

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