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Embedded forming technology for composite board, composite board and forming milling cutter

A composite plate and embedded molding technology, which is applied in the direction of milling cutters, manufacturing tools, milling machine equipment, etc., can solve the problems of long molding process cycle, product micro-cracks, large energy loss, etc., to improve mechanical properties and appearance quality, avoid Stress, energy saving effect

Inactive Publication Date: 2017-05-24
HEFEI LCFC INFORMATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. It is necessary to heat the entire plate and soften the thermoplastic sandwich layer before closing the mold, and in the process of mold closing, it is necessary to exert a large pressure on the substrate to extrude the thermoplastic sandwich layer, resulting in molding Long process cycle and large energy consumption
[0005] 2. During the molding process, the substrate is squeezed by clamping pressure, which causes the substrate to deform
After spraying, stress marks appear in the stress concentration area, which affects the appearance; microcracks appear in the product during the process of spraying, baking, transportation and storage, and stress release after heating

Method used

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  • Embedded forming technology for composite board, composite board and forming milling cutter
  • Embedded forming technology for composite board, composite board and forming milling cutter
  • Embedded forming technology for composite board, composite board and forming milling cutter

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Embodiment Construction

[0047] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0048] The embodiment of the present invention discloses a composite plate embedded molding process, please refer to Figures 1 to 7 , the composite sheet embedding molding process is used to combine the substrate 10 with the injection resin 40 so that the substrate 10 and the injection resin 40 form a composite sheet. Among them, such as figure 1 As shown, the substrate 10 includes two carbon fiber plies 1 and a sandwich layer 2 between the two carbon fiber plies 1, the sandwich layer 2 can be made of thermoplastic material, such as PP material, but not limited to thermoplastic material, For example, lightweight nanosandwich layers can also be employed. The composite plate embedded molding process specifically includes the fol...

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Abstract

The invention discloses an embedded forming technology for a composite board. The embedded forming technology for the composite board includes the following steps that S10, the fracture surface of a base plate is subjected to cutting work, so that an inward recessed part or an outward raised part is formed in the middle of the fracture surface; S20, the cut base plate is arranged in a female die; S30, a male die and the female die are subjected to die assembly, and an injection cavity is defined on the edge of the base plate by the male die and the female die in a surrounded mode; S40, injection molding resin is injected to the injection cavity surrounded by the male die and the female die; and S50, the dies are cooled so that the injection molding resin can be cured onto the fracture surface of the base plate. According to the embedded forming technology for the composite board, energy can be better saved, cooling time is shortened, and the forming cycle is shortened; and the base plate is hardly stressed by external force, deformation and stress concentration of the base plate cannot happen, stress is avoided, and the mechanical property and appearance quality of the composite board are improved.

Description

technical field [0001] The invention relates to the technical field of processing technology, in particular to a composite plate embedding molding process, a forming milling cutter and a composite plate. Background technique [0002] In the prior art, in order to facilitate the embedded molding of the composite board, the substrate in the composite board is composed of two carbon fiber board layers and a thermoplastic sandwich layer between the two carbon fiber board boards. The specific embedding molding process is as follows: firstly, the substrate is placed in the master mold, and then the substrate is heated in the master mold to soften the thermoplastic sandwich layer; secondly, the male mold and the female mold are clamped. In the process, the clamping force (pressure on the substrate) is used to make the convex structure of the male mold squeeze the edge of the carbon fiber sheet layer, so that the thermoplastic sandwich layer is deformed to protrude from the cross se...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29D7/01B29C45/14B23C5/12B29L7/00
CPCB29D7/01B23C5/12B29C45/14508B29C2045/1454B29C2045/14868B29L2007/002
Inventor 卢永裕张书炜吴运峰黄孟凯
Owner HEFEI LCFC INFORMATION TECH