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A liquid metal with anti-melting properties for heat dissipation at 54-61°C

A liquid metal, weight percentage technology, applied in the field of alloys, can solve the problems of increased fluidity of liquid metal, and achieve the effects of simple processing and smelting methods, satisfactory heat transfer performance and thermal stability, and low production cost

Active Publication Date: 2018-08-31
NINGBO SYRNMA METAL MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, one of the difficulties in the application of liquid metals in the industry is the fluidity of liquid metals at the use temperature and the fluidity intensifies after the temperature rises.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] A liquid metal used for heat dissipation at 54-61°C and has anti-melting properties. The composition of the alloy is: Sb: 6.3%, Bi: 8.4%, Sn: 6.5%, Ag: 0.2%, Zn : 2.3%, La: 0.3, and the balance is In. The alloy with the above composition was melted in a graphite crucible in a vacuum induction melting furnace at 420° C., and homogenized by electromagnetic stirring for 10 minutes. It is then cast using a graphite mold and the casting is rolled to a foil thickness of around 0.05mm. The alloy exhibits a solid-liquid state at about 55°C and has sufficient viscosity. When the temperature is higher than 62 ° C, due to the increase in solid content, the phenomenon of remelting occurs and solidifies.

Embodiment 2

[0016] A liquid metal used for heat dissipation at 54-61°C and has anti-melting properties. The composition of the alloy is: Sb: 8.3%, Bi: 3.4%, Sn: 7.4%, Ag: 0.3%, Zn : 2.6%, La: 0.4%, and the balance is In. The alloy with the above composition was melted in a graphite crucible in a vacuum induction melting furnace at 440° C., and homogenized by electromagnetic stirring for 10 minutes. It is then cast using a graphite mold and the casting is rolled to a foil thickness of around 0.05mm. The alloy exhibits a solid-liquid state at about 57°C and has sufficient viscosity. When the temperature is higher than 63 ° C, due to the increase in solid content, the phenomenon of remelting occurs and solidifies.

Embodiment 3

[0018] A liquid metal that is used for heat dissipation at 54-61°C and has anti-melting properties. The composition of the alloy is: Sb: 12.5%, Bi: 6.4%, Sn: 19.8%, Ag: 0.3%, Zn : 2.6%, La: 0.3%, and the balance is In. The alloy with the above composition was melted in a graphite crucible in a vacuum induction melting furnace at 430° C., and homogenized by electromagnetic stirring for 10 minutes. It is then cast using a graphite mold and the casting is rolled to a foil thickness of around 0.05mm. The alloy exhibits a solid-liquid state in the temperature range of 59°C and has sufficient viscosity. When the temperature is higher than 64 ° C, due to the increase in solid content, the phenomenon of remelting occurs and solidifies.

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Abstract

The invention discloses liquid metal with the anti-fusion feature and for under the temperature of 54-61 DEG C. The metal is composed of, by weight, 4-28% of Sb, 1-10% of Bi, 1-30% of Sn, 0.2-0.4% of Ag, 2-3% of Zn, 0.2-6% of La and the balance In. Within the range of the temperature 54-61 DEG C, the liquid metal is in a solid-liquid state and has enough viscosity. When the temperature is higher than 62-64 DEG C, the anti-fusion phenomenon occurs due to the fact that the content of a solid phase is increased, and thus solidification is generated. Based on the effect that the heat transfer property and thermodynamic property of liquid metal for an existing computer chip with the temperature being about 59 DEG C are ensured, the feature of multi-phase alloy generating anti-fusion behaviors after the temperature is increased again is introduced to liquid metal design, and the range of alloy components suitable for heat dissipation within the range of 54-61 DEG C is appointed. After the temperature is higher than 62-64 DEG C, the liquid metal conducts the anti-fusion behaviors due to the fact that the content of the solid phase is increased. Therefore, it is ensured that the liquid metal cannot laterally leak in the using process of the computer chip, and thus safety of heat dissipation is improved.

Description

technical field [0001] The invention relates to the technical field of alloys, in particular to a liquid metal formula. Background technique [0002] With the rapid development of contemporary electronic technology, the degree of integration and assembly density of electronic components continues to increase. While providing powerful usage functions, it also leads to a sharp increase in its working power consumption and heat generation. High temperatures will have a detrimental effect on the stability, reliability and life of electronic components. Therefore, ensuring that the heat generated by the heating electronic components can be discharged in time has become an important aspect of the system assembly of microelectronic products. For portable electronic products with high integration and assembly density (such as notebook computers, etc.), heat dissipation has even become the technical bottleneck of the entire product. [0003] There are extremely fine uneven gaps be...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C28/00C22C30/06H05K7/20
CPCC22C13/00C22C13/02C22C28/00C22C30/04C22C30/06H05K7/2039
Inventor 曹帅刘亚军郭强
Owner NINGBO SYRNMA METAL MATERIALS CO LTD
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