Stripping device and stripping method adopting same

Abstract

The invention discloses a stripping device and a stripping method adopting the same, which are used for stripping a flexible substrate from a substrate. The stripping device comprises a laser transmitter and a coil unwinding wheel, wherein the coil unwinding wheel is provided with a roller and a plurality of suckers positioned on the roller; the laser transmitter is used for transmitting laser to an interface between the flexible substrate and the substrate at an edge area of the flexible substrate; the coil unwinding wheel is used for adsorbing the flexible substrate by adopting the suckers; the whole flexible substrate is wound by using the rolling of the roller. According to the stripping device provided by the embodiment of the invention, adverse influence such as deformation of the flexible substrate and damage to an active layer caused by a laser integral stripping technology can be avoided, and no deformation and no damage of the flexible substrate in a stripping process are guaranteed.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a stripping device and a stripping method thereof. Background technique [0002] In recent years, flexible display has developed rapidly as a key technology for next-generation display. Flexible display devices use a rollable flexible substrate, which is made of soft materials and is characterized by variable shape, bendability, and light and thin , Easy to carry and so on. [0003] At present, in the manufacture of flexible substrates, in order to peel the flexible substrates from the glass substrates, the method usually adopted is the laser whole peeling method, that is, the whole flexible substrates formed on the glass substrates are peeled off by the laser light passing through the glass substrates. In the process of such methods, the heat is not easy to dissipate, and the excessively high temperature will deform the flexible substrate and reduce the flatness. In addition, ...

AI Technical Summary

Problems solved by technology

[0003] At present, in the manufacture of flexible substrates, in order to peel the flexible substrates from the glass substrates, the method usually adopted is the laser whole peeling method, that is, the whole flexible substrates formed on the glass substrates are peeled off by the laser light passing through the glass substrates. In the process of this kind of method, the heat is not easy to dissipate. Excessively high temperature will deform the flexible substrate and reduce the flatness. In addition, the direct irradiation of the laser will destroy the performance of the active layer in the flexible substrate, resulting in serious defects.

Images