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The heat dissipation device of the robot control motherboard and the robot

A technology for controlling motherboards and heat dissipation devices, applied in the field of heat conduction, can solve the problems of large space occupation, high noise of air-cooled heat dissipation devices, and easy-to-generate intelligent robots, etc., and achieves increased heat dissipation efficiency, increased heat dissipation area, and high heat conduction rate. Effect

Active Publication Date: 2019-05-31
BEIJING QIHOO TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the water-cooled heat dissipation is to lay a pipe filled with heat-absorbing liquid on the motherboard where the CPU is installed, and dissipate heat by making the heat-absorbing liquid flow. The water-cooled heat dissipation has a strong heat dissipation capacity, but requires a large heat dissipation space. Only then can it play a role; air-cooled heat dissipation is to attach a heat sink made of heat-dissipating material to the motherboard where the CPU is installed, and drive the airflow in the internal space to flow through the fan to dissipate heat. Air-cooled heat dissipation can be applied to Heat dissipation in a small space, but because the air-cooled heat dissipation uses fan rotation to dissipate heat, it is easy to generate noise, which is not conducive to intelligent robots controlled by voice commands
[0004] The inventors of the present invention found in the research that the water-cooled heat sink in the prior art cannot be installed in an intelligent robot with limited space for heat dissipation due to its large footprint; Too large to be suitable for intelligent robots controlled by voice commands

Method used

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  • The heat dissipation device of the robot control motherboard and the robot
  • The heat dissipation device of the robot control motherboard and the robot
  • The heat dissipation device of the robot control motherboard and the robot

Examples

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Embodiment 1

[0038] see figure 1 , figure 1 It is a structural schematic diagram of the heat dissipation device of the robot control main board 100 according to the embodiment of the present invention.

[0039] like figure 1 As shown, a heat dissipation device for a robot control main board 100, the heat dissipation device for a robot control main board 100 includes: a heat sink 200 and heat dissipation silica gel. Among them, the heat sink 200 is provided with a storage space for accommodating the heat-generating body raised on the surface of the robot control motherboard 100; the heat-dissipating silica gel is filled in the storage space to connect the heat-generating body and the heat-dissipating fin 200, and transfer the heat in the heat-dissipating fin 200 to the heat-dissipating silica gel middle.

[0040] The heat sink 200 is specifically constructed as a panel that is consistent with the outline of the robot control main board 100, and the heat sink 200 is consistent with the ou...

Embodiment 2

[0087] A robot, the robot includes a robot control mainboard for carrying a robot CPU, a heat dissipation device is attached to the robot control mainboard, and the heat dissipation device is the heat dissipation device for the robot control mainboard mentioned in Embodiment 1.

[0088] The robot using this cooling device increases the heat dissipation area of ​​the robot control board by attaching a heat sink on the robot control board, and provides a storage space on the heat sink for accommodating the heating element raised on the surface of the robot control board. The space and the heating body are connected by heat-dissipating silica gel, which can make the connection between the heat sink and the robot control motherboard more tightly, and can make the heat conduction rate between the heating body and the heat sink higher, increasing the heat dissipation efficiency of the heat sink .

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Abstract

An embodiment of the invention discloses a cooling device of a control mainboard of a robot and the robot. The cooling device comprises a heat sink and cooling silica gel, wherein the heat sink is provided with accommodating spaces for accommodating heating elements bulging on the surface of the control mainboard of the robot; the accommodating spaces are filled with the cooling silica gel which is connected with the heating elements and the heat sink and transfers heat in the heating elements into the heat sink. The cooling area of the control mainboard of the robot is increased by attaching the heat sink on the control mainboard of the robot, the accommodating spaces for accommodating the heating elements bulging on the surface of the control mainboard of the robot are formed in the heat sink and are connected with the heating elements through the cooling silica gel, so that the heat sink and the control mainboard of the robot are connected more tightly, the rate of heat conduction between the heating elements and the heat sink can be higher, and the cooling efficiency of the cooling device is increased.

Description

technical field [0001] Embodiments of the present invention relate to the field of heat conduction, in particular to a heat dissipation device for a robot control motherboard and a robot. Background technique [0002] With the development of mobile communication, computer and Internet technology, intelligent robots are widely used in the fields of education, scientific research or security due to their small size and strong processing capabilities, and are recognized by users. Along with the development of intelligent robots, robots with higher intelligence require more powerful processing capabilities of their CPUs, and the processing speed of CPUs is closely related to the heat dissipation rate of their cooling devices. [0003] In the prior art, there are mainly two heat dissipation principles of the heat dissipation device provided: one is water-cooled heat dissipation, and the other is air-cooled heat dissipation. Among them, the water-cooled heat dissipation is to lay...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20409H05K7/20463
Inventor 韦绥均杨刚
Owner BEIJING QIHOO TECH CO LTD