Adhesive dispersing mechanism and adhesive dispersing amount metering control method applying same

Abstract

The invention provides an adhesive dispersing mechanism and an adhesive dispersing amount metering control method applying the same. The adhesive dispersing mechanism comprises a base plate, a stepping motor, a ball bearing lead screw, a lead screw nut, a flexible connecting assembly, a piston rod, a piston and an adhesive barrel, wherein the ball bearing lead screw is in transmission connection with the stepping motor; the lead screw nut is matched with the ball bearing lead screw; one end of the flexible connecting assembly is fixedly connected with the lead screw nut; the piston rod is fixedly connected with the other end of the flexible connecting assembly; the piston is fixed to the piston rod; the adhesive barrel is fixedly connected to the base plate; and the piston is connected into a cylindrical inner cavity of the adhesive barrel in a sliding manner. According to the adhesive dispersing amount metering control method, the actual adhesive dispersing amount is measured accurately, calculated and obtained on the basis of the mass difference principle; the adhesive dispersing amount is compared with the standard adhesive dispersing amount, so that the adhesive dispersing amount of the adhesive dispersing mechanism is adjusted; quantitative control over the adhesive dispersing amount is achieved; adhesive dispersing quality is improved; the adhesive outlet amount is precisely controlled through the rotation angle of the stepping motor and the volume variation of the adhesive barrel; and the adhesive dispersing amount can be controlled precisely, and adhesive dispersing quality can be improved.

Description

technical field [0001] The invention relates to a packaging device and a control method thereof, in particular to a dispensing mechanism and a method for measuring and controlling the dispensing amount of the dispensing mechanism. Background technique [0002] At present, the microelectronics industry has become an important part of the development of the national economy, and the design, manufacture, packaging and testing of integrated circuits are the three pillar industries for the development of the microelectronics industry. Microelectronic packaging not only affects the mechanical properties, electrical properties, thermal properties and optical properties of the integrated circuit itself, but also affects its reliability and cost, which largely determines the miniaturization, reliability and cost of the electronic system. [0003] The dispensing process is one of the important steps to complete microelectronic packaging. This process is usually realized by a dispensin...

AI Technical Summary

Problems solved by technology

The dispensing mechanisms of traditional dispensing machines usually include four types: time / pressure dispensing, Archimedes screw dispensing, piston dispensing and peristaltic dispensing. The control of the liquid dispensing volume is realized by adjusting the pressure of the compressed air and its action time. Therefore, the air pressure and the dispensing time become the main factors affecting the dispensing volume. However, the air repeatedly compresses the glue during the dispensing process. Make it generate heat, and the viscosity of the glue is very sensitive to temperature, which will affect the control of the dispensing amount, and with the increase of the compressed air volume, the compression time will increase, which makes the dispensing time difficult to control, and also It will affect the control of the dispensing volume; the Archimedes screw dispensing is mainly based on the Archimedes solenoid. When there is resistance, the glue can flow. Therefore, the force of the screw and the fluid resistance are the main factors affecting the amount of glue dispensed in this dispensing method, but it is also sensitive to changes in the viscosity of the glue, and it is not easy to accurately control; Piston dispensing is mainly based on the "piston-cylinder" mechanism, and the control of the dispensing volume is realized by controlling the fluid volume in the cylinder. The glue quality has been improved, but the dispensing speed is slow, and the dispensing volume is not easy to adjust; peristaltic dispensing is based on the pumping effect of the peristaltic pump to achieve quantitative dispensing. Since the peristaltic pump needs to use flexible pump tubes, it bears The pressure is low, and it is difficult to achieve high efficiency

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