Synthesis of diphenylether-formaldehyde resin

A formaldehyde resin, diphenyl ether technology, used in aldehyde/ketone condensation polymer adhesives, adhesive types, adhesive additives, etc., can solve the problem of LOCA not curing, not absorbing UV light, incomplete curing, etc. problem, to achieve the effect of low production cost, easy control, and no solvent

Inactive Publication Date: 2017-06-09
孙萌萍
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, some specially designed capacitive touch screens have large FPC lines on the conductive glass. Because the FPC itself does not transmit UV light, the LOCA (liquid optical transparent glue) glue under the FPC is often blocked by the FPC. role, but can not absorb UV light, eventually causing LOCA (liquid optically clear adhesive) to not cure, or to cure incompletely

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0009] Diphenyl ether formaldehyde resin 80g, HDI trimer 32g, 3-ethyl-3-oxetanemethanol 5g, hydroxyethyl methacrylate 10g, polymerization inhibitor p-hydroxyanisole 0.1g, catalyst dilaurel Add 0.01 g of dibutyltin dibutyltin into a three-necked flask with a thermometer, raise the temperature to 80 degrees, control the temperature at 80 degrees, react for 3 hours, stop the heating reaction, and obtain diphenyl ether formaldehyde resin.

Embodiment 2

[0011] Diphenyl ether formaldehyde resin 90g, HDI trimer 40g, 3-ethyl-3-oxetanemethanol 5g, hydroxyethyl methacrylate 10g, polymerization inhibitor p-hydroxyanisole 0.1g, catalyst dilaurel Add 0.01g of dibutyltin dibutyltin into a three-necked flask with a thermometer, raise the temperature to 90°C, control the temperature at 90°C, react for 6h, stop the heating reaction, and obtain diphenyl ether formaldehyde resin.

Embodiment 3

[0013] Diphenyl ether formaldehyde resin 85g, HDI trimer 38g, 3-ethyl-3-oxetanemethanol 5g, hydroxyethyl methacrylate 10g, polymerization inhibitor p-hydroxyanisole 0.1g, catalyst dilaurel Add 0.01 g of dibutyltin dibutyltin into a three-necked flask with a thermometer, raise the temperature to 85 degrees, control the temperature at 85 degrees, react for 5 hours, stop the heating reaction, and obtain diphenyl ether formaldehyde resin.

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Abstract

The invention relates to synthesis of diphenylether-formaldehyde resin. A process comprises the following steps that 80 to 90g of diphenylether-formaldehyde resin, 32 to 40g of HDI trimers, 5g of 3-ethyl-3-hydroxymethyleneoxetane, 10g of hydroxyethyl methylacrylate, 0.1g of polymerization inhibitors of 4-methoxyphenol and 0.01g of catalysts of dibutyl tin laurate are added into a three-opening flask with a temperature indicator; the temperature is raised to 80 to 90 DEG C; the temperature is controlled to be 80 to 90 DEG C; the reaction is taken for 3 to 6hours; the heating reaction is stopped, and the diphenylether-formaldehyde resin is obtained.

Description

technical field [0001] The invention relates to the synthesis of a diphenyl ether formaldehyde resin and belongs to the field of synthetic chemistry. Background technique [0002] The surface protective layer and conductive layer of capacitive touch screen are mostly made of glass substrate, and its refractive index is about 1.52. Therefore, the refractive index of the bonding material is required to be as equal as possible, which can greatly reduce the refraction loss of light between the interfaces and improve the performance of the panel. The contrast and clarity of the display in brightly lit environments. At the same time, under harsh conditions such as ultraviolet radiation, humidity and heat aging, and thermal shock, optically transparent adhesives need to maintain the stability of important indicators such as high light transmittance and low yellowing. [0003] At present, some specially designed capacitive touch screens have large FPC lines on the conductive glass....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J161/00C09J11/06
Inventor 孙萌萍
Owner 孙萌萍
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