Compact type handheld welding spot ultrasonic automatic scanner

A hand-held, compact technology, applied in the use of sound waves/ultrasonic waves/infrasonic waves to analyze solids, use sound waves/ultrasonic waves/infrasonic waves for material analysis, instruments, etc. , to achieve the effects of reduced size requirements, high scanning accuracy, and strong practicability

Active Publication Date: 2017-06-13
JILIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is costly, takes up a large area, and cannot be applied to the case of large workpieces, so it is difficult to be widely used

Method used

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  • Compact type handheld welding spot ultrasonic automatic scanner
  • Compact type handheld welding spot ultrasonic automatic scanner
  • Compact type handheld welding spot ultrasonic automatic scanner

Examples

Experimental program
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Effect test

Embodiment Construction

[0023] In the following, in conjunction with the accompanying drawings, the detection of a MIG solder joint workpiece with a diameter of 15 mm is taken as an example to further illustrate the details of the present invention and its specific implementation.

[0024] See Figure 1 to Figure 6 As shown, the compact handheld solder joint ultrasonic automatic scanner of the present invention includes a housing module, an X-direction motion module, a Y-direction motion module, an ultrasonic transmitter / receiver module, and an accessory module. The housing module is connected and fixed. The X-direction movement module and the accessory module are fixed to the housing module; the X-direction movement module has a built-in motor drive device to realize the X-direction scanning movement relative to the housing module; the Y-direction movement module is connected to the X-direction movement module , Built-in motor drive device to realize Y-direction scanning movement relative to the X-dire...

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Abstract

The invention relates to a compact type handheld welding spot ultrasonic automatic scanner and belongs to the field of ultrasonic testing. The compact type handheld welding spot ultrasonic automatic scanner comprises a shell module, an X directional motion module, a Y directional motion module, an ultrasonic emitting-receiving module and an accessory module, wherein the X directional motion module and the accessory module are fixed on the shell module; the Y directional motion module is connected with the X directional motion module; the ultrasonic emitting-receiving module is fixed on the Y directional motion module; the accessory module is used for connecting an internal circuit with an external circuit of the scanner, so as to realize the internal and external signal transmission. The invention has the advantages that a precise mechanical structure is used for driving a single point type water leaching ultrasonic probe to move in the scanner and guaranteeing higher scanning precision of the handheld welding spot ultrasonic automatic scanner; an external water leaching system is not required; the scanning cost is lowered; the size requirement for a to-be-detected workpiece is reduced; through the reasonably distributed motor position and driving mode, the volume of the ultrasonic scanner is reduced, the handheld operation is convenient and the practicability is high.

Description

Technical field [0001] The invention relates to the field of ultrasonic testing, in particular to a compact handheld welding spot ultrasonic automatic scanner. Background technique [0002] Ultrasound is often used for internal defect detection of workpieces. In the field of ultrasonic inspection of solder joints, single-point ultrasonic probes are often used. By manually moving the position of the ultrasonic probe, A-scan detection is performed on a certain position to determine the internal quality status of a certain area of ​​the workpiece. This detection method is only suitable for qualitative judgment and cannot be used for quantitative evaluation. [0003] Quantitative ultrasonic testing generally has the following two methods: One is to use an ultrasonic phased array probe to cover the solder joints, which can achieve quantitative detection of the internal quality of the solder joints. Due to the high cost of phased array probes, it is difficult to be widely used. Another...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N29/04G01N29/265
CPCG01N29/043G01N29/265G01N2291/023
Inventor 徐国成董娟谷晓鹏王亭
Owner JILIN UNIV
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