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Circuit board and device with same

A circuit board and circuit carrier technology, which is applied in the direction of circuit heating devices, circuits, printed circuits, etc., can solve problems such as cracks and circuit failures, and achieve the effects of better cooling, better cooling, and reduced service life

Inactive Publication Date: 2017-06-13
ZF FRIEDRICHSHAFEN AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The result may be cracks or small cracks in the solder connection between the connecting pin and the solder surface (circuit board pad) on the board, which may lead to failure of the entire circuit

Method used

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  • Circuit board and device with same
  • Circuit board and device with same
  • Circuit board and device with same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] figure 1 A sectional view of an exemplary arrangement according to the prior art is shown with a circuit board 2 and a highly integrated circuit carrier 3 . The circuit board 2 has a first soldering region 5a with a plurality of solder pads 5 on the first main surface 2a. Between the pads 5 , second soldering regions 6 a in the form of pads 6 are applied on the first main surface 2 a of the circuit board 2 . Soldering pads 5 , 6 are arranged at the same height on soldering regions 5 a , 6 a. The necessary amount of solder, controlled in particular by the layer thickness L of the solder paste used, can vary from the first soldering region 5 a to the second soldering region 6 a. This essentially depends on the structural tolerances, in particular the spacing value (StandOff) of the components 3 to be welded. The distance value is to be understood as the height difference between the lower edge of the connection pin 4 and the lower edge of the heat-conducting surface 7 ...

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Abstract

The invention relates to a circuit board, and a device with the circuit board. A first soldering region (5a) with soldering discs, for connecting a circuit board (2) and a connection pin (4) of an integrated circuit carrier (3) and a second soldering region (6a) for connecting the circuit board (2) and a heat conductive surface (7) of the integrated circuit carrier (3) exist in at least one main surface (2a); a plurality of soldering discs (5) of the first soldering region (5a) are arranged on rectangular or square edge curve (8) in at least section manner; the second soldering region (6a) is arranged in the edge curve (8); the second soldering region (6a) is divided into a plurality of soldering discs (6); and a soldering shielding portion is formed between every two adjacent soldering discs (6).

Description

technical field [0001] The invention relates to a circuit board according to claim 1 and a device according to claim 8 . Background technique [0002] Electronic components are constantly subject to the trend of becoming smaller and smaller with the same or increased range of functions due to higher installation space requirements. As a result, the power density in the components increases, which requires further development of existing solutions or the use of new concepts in order to meet the higher thermal requirements. [0003] In highly integrated circuits (such as IC integrated circuits; integrated circuit) or SMD components (such as drive structure modules or power components), where greater power losses and thus high thermal power are formed, these thermal power must pass through the circuit and Solder connection leads out of the carrier (e.g. circuit board). For this purpose, such highly integrated circuits usually have a heat-conducting surface, also referred to a...

Claims

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Application Information

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IPC IPC(8): H05K1/11
CPCH05K1/11H05K2201/09409H01L23/36H05K1/0203H05K3/3436H05K3/3452H05K2201/09036H01L23/49838H05K1/111Y02P70/50H01L23/367H05K1/0204H05K1/181H05K3/36H05K3/4007H05K2201/10378
Inventor 斯特凡·卢普里希
Owner ZF FRIEDRICHSHAFEN AG
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