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Corrosion Resistant Retaining Ring

A technology for retaining rings and annular parts, applied in the direction of working carriers, electrical components, circuits, etc., can solve problems such as defects, agglomeration, and return substrates

Active Publication Date: 2019-06-14
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Additionally, adhering material can agglomerate and back onto the polishing pad and thus become a source of substrate defects

Method used

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  • Corrosion Resistant Retaining Ring
  • Corrosion Resistant Retaining Ring
  • Corrosion Resistant Retaining Ring

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] Described herein are retaining rings, chemical mechanical planarization systems (CMP), and methods for polishing substrates. The retaining ring includes encapsulation of the metal portion to extend the life of the retaining ring.

[0015] figure 1 is a partial cross-sectional view of a chemical mechanical polishing system (CMP) 100 . CMP system 100 includes carrier head 150 that holds substrate 135 (shown in phantom) inside retaining ring 130 and places substrate 135 in contact with polishing surface 180 of polishing pad 175 during processing. A polishing pad 175 is placed on a worktable 176 . Table 176 is coupled to motor 184 via table shaft 182 . Motor 184 rotates table 176 and thus polishing surface 180 of polishing pad 175 about axis 186 of table axis 182 when CMP system 100 polishes substrate 135 .

[0016] CMP system 100 may include chemical delivery system 190 and pad cleaning system 160 . The chemical delivery system 190 includes a chemical tank 196 that ho...

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PUM

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Abstract

Embodiments described herein protect a retaining ring of a polishing system from aggressive polishing chemicals. In one embodiment, the retaining ring has an annular body with a top surface, an inner diameter sidewall, an outer diameter sidewall and a bottom surface. The inner diameter sidewall is configured to define a base plate. The annular body has: a rigid annular portion; a polymeric annular portion stacked on the rigid annular portion and covering at least three sides of the rigid annular portion; a plurality of grooves formed in the bottom surface; and a plurality of drain ports formed through the polymeric annular portion, wherein the drain ports are isolated from the rigid annular portion.

Description

technical field [0001] Embodiments of the invention relate to polishing systems for polishing substrates, such as semiconductor substrates. More particularly, embodiments relate to retaining rings, chemical mechanical planarization (CMP) systems, and methods for increasing retaining ring lifetime. Background technique [0002] Chemical mechanical polishing (CMP) is a common process used in the manufacture of high-density integrated circuits to planarize or polish material layers deposited on a substrate. A carrier head may provide a substrate held therein to a polishing station of a CMP system and controllably push the substrate against a moving polishing pad in the presence of a polishing fluid. Through a combination of chemical and mechanical activity, material is removed from the feature side of the substrate in contact with the polishing surface. The material removed from the substrate during polishing is suspended in the polishing fluid. Suspended material is removed...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/32
CPCB24B37/32H01L21/304
Inventor 甘加达尔·希拉瓦特西蒙·亚沃伯格胡永其
Owner APPLIED MATERIALS INC