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Double-station separation mold for high-density pin integrated circuit and its usage

An integrated circuit and double-station technology, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc., can solve problems such as pin circuit failure and pin deformation, and achieve the effect of avoiding insufficient strength and meeting strength requirements

Inactive Publication Date: 2019-05-10
TONGLING SANJIA YAMADA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is that when the existing high-density pin integrated circuits are separated, the pins will be deformed, and in severe cases, even the contact between the pins will cause the circuit to fail. Double-station separation mold for electric circuit and its application method

Method used

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  • Double-station separation mold for high-density pin integrated circuit and its usage
  • Double-station separation mold for high-density pin integrated circuit and its usage
  • Double-station separation mold for high-density pin integrated circuit and its usage

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Embodiment Construction

[0015] The present invention will be further described below in conjunction with the drawings.

[0016] Such as figure 2 , image 3 As shown, the dual-station separation mold for high-density pin integrated circuits includes an upper female mold assembly and a lower male mold assembly. The lower male mold assembly includes a lower male mold base 9 and a fixed connection respectively. The first separation station limit post 17 and the second separation station limit post 8 at both ends of the lower punch base, the first separation station limit post is higher than the second separation station limit post, the In the middle of the lower punch base, there are first separating punches 15 and second separating punches 16 alternately distributed along the horizontal direction, and the height of the first separating punches is higher than that of the second separating punches; the upper concave die set The parts include an upper die base 7 and a first vertical guide rod 10 and a second...

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Abstract

The invention discloses a double-station separating die for high-density pin integrated circuit and a using method thereof. The die includes an upper recessed die assembly and a lower protruding die assembly, the lower protruding die assembly includes a lower protruding die base (9) and a first separating station limiting column (17) and a second separating station limiting column (8) fixedly connected with the two ends of the lower protruding die base, the first separating station limiting column is higher than the second separating station limiting column, the middle of the lower protruding die base is alternatively provided with a first separating protruding die (15) and a second separating protruding die (16) at an interval along the horizontal direction, and the first separating protruding die is higher than the second separating protruding die. For the integrated circuit product pin crossing condition, the problem of mutual interference during the product discharging due to the pin crossing can be solved, meanwhile, by means of the double-station separation, the problem that the knife-edge member strength is no enough when the product is separated simultaneously can be effectively prevented, and the strength requirement of the corresponding knife-edge member can be met.

Description

Technical field [0001] The present invention relates to a separate mold for SOP / TSSOP / SSOP type mounting products, and in particular to a separate mold for integrated circuits with high-density cross pins and a method of use thereof. Background technique [0002] With the rapid development of the semiconductor industry, the production process of the basic electronic components of the semiconductor industry has also undergone great changes. In order to meet the requirements of high-volume, high-efficiency and low-cost, packaging and testing in integrated circuit production is increasingly pursuing high-density product production, requiring as many integrated circuit products as possible in a unit area. Under the existing process conditions, due to the limitation of the processing range of the wire bonding machine, the width of the lead frame is limited to less than 100mm. Considering the engineering yield and cost factors, the width of the frame is generally limited in actual engi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/77
CPCH01L21/67011H01L21/77
Inventor 付小青丁宁李庆生贡喜刘文涛刘正龙
Owner TONGLING SANJIA YAMADA TECH
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