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A kind of separation equipment and separation method

A separation equipment, rigid technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems affecting production efficiency and product yield, time-consuming, etc., to reduce separation time-consuming, improve product yield, improve production efficiency effect

Active Publication Date: 2019-03-12
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the need for an alignment step before separation, it takes a long time, and at the same time, alignment failure will inevitably occur, which will affect production efficiency and product yield

Method used

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  • A kind of separation equipment and separation method
  • A kind of separation equipment and separation method
  • A kind of separation equipment and separation method

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Embodiment Construction

[0031] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will clearly and completely describe the technical solutions of the embodiments of the present invention in conjunction with the drawings of the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention belong to the protection scope of the present invention.

[0032] In order to solve the problem that an alignment step is required when separating the rigid carrier substrate and the protective film in the prior art, resulting in a long time-consuming edge separation, and the failure of alignment is likely to cause damage to the rigid carrier substrate and flexible devices, please refer to figure 1 with figure 2 , an embodiment of the present inv...

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Abstract

The present invention provides a separation device and separation method, which is used to separate the devices to be separated, which includes the rigid bearing substrate, the flexible device set on the rigid bearing substrate, and covered with the flexible devices.The knife control component is used to control the at least one edge of the air -knife to the junction of at least one edge of the protective film and the junction of the fitting plate of the rigid bearing plate, so that the protective film is separated from the rigid bearing substrate.When the separation of the separation of the present invention is separated from the rigid loading substrate and the flexible device, the separation time can be reduced, and it will not cause damage to the rigid bearing board and flexible devices.

Description

technical field [0001] The invention relates to the field of flexible device manufacturing technology, in particular to a separation device and a separation method. Background technique [0002] During the fabrication of flexible OLED (Organic Light Emitting Diode) devices, a rigid carrier substrate is usually provided first, and then a flexible device is formed on the rigid carrier substrate. The flexible device usually includes a flexible substrate and an OLED device disposed on the flexible substrate. After the flexible device is fabricated, the flexible device needs to be peeled off from the rigid carrier substrate. In the prior art, laser irradiation is usually used to separate the flexible device from the rigid carrier substrate. During laser irradiation separation, the flexible device needs to be placed facing the abutment. In order to avoid direct contact between the flexible device and the abutment, the flexible device can be placed on the The device is covered wit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/56
CPCH10K71/00
Inventor 王伟孙中元倪静凯罗程远
Owner BOE TECH GRP CO LTD