Semiconductor Package Handling Equipment
A technology for processing devices and packages, applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problems of process delay, difficulty in uniformly attaching semiconductor packages, and reduced work efficiency, etc. To achieve the effect of enhancing the adhesion state
Active Publication Date: 2022-01-14
HANMI SEMICON CO LTD
View PDF6 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] In the conventional semiconductor package processing equipment, in order to perform the sputtering process, it is difficult to uniformly attach the semiconductor package during the process of attaching the semiconductor package to the fixed film formed on the frame, which causes a delay in the process.
[0006] In addition, there are burrs (burr) formed by the sputtering evaporation material remaining around the edge where the bottom surface and the side surface of the sputtered semiconductor package are in contact. It is necessary to remove the burr by manual work, thus reducing the work efficiency. , and difficult to use automation
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0042] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described here, but may be embodied in other forms. Rather, the embodiments described herein are used to complete the disclosure and also to fully convey the idea of the invention to those skilled in the art to which the invention pertains. Throughout the specification, the same reference numerals denote the same structural elements.
[0043] figure 1 It is a top view of an embodiment of the semiconductor package processing apparatus 1 of the present invention.
[0044] The semiconductor package processing apparatus 1 of the present invention includes: a frame supply and recovery unit 100, which supplies a frame (not shown) for performing a sputtering process in a state where a plurality of semiconductor packages are attached, and collects and separates the frame of the s...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The present invention relates to a semiconductor package processing apparatus which, after separating a semiconductor package that has completed a sputtering process from a frame having a fixing film, effectively removes burrs remaining on the semiconductor package through a sputtering process, and then transports the semiconductor package, Alternatively, a semiconductor package supplied from a semiconductor package supply section is picked up and stably attached to a frame having a fixing film for a semiconductor package sputtering process and fixed.
Description
technical field [0001] The present invention relates to a semiconductor package processing apparatus. In more detail, the present invention relates to transporting a semiconductor package after the sputtering process has been completed by separating the semiconductor package from a frame having a fixing film, and then effectively removing burrs remaining on the semiconductor package through the sputtering process. A package or a semiconductor package processing apparatus that picks up a semiconductor package supplied from a semiconductor package supply unit and stably attaches and fixes it to a frame having a fixing film for a semiconductor package sputtering process. Background technique [0002] The present invention relates to semiconductor package handling apparatus. Semiconductor packages for electronic products In order to block electromagnetic waves that affect the human body or minimize electrical interference that occurs between adjacent electronic products, a sputt...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67121H01L23/528H01L24/26H01L21/67712
Inventor 林栽瑛
Owner HANMI SEMICON CO LTD