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Thermoelectric cooling module and heat dissipation device comprising same

A technology for thermoelectric cooling and cooling chips, which is applied to machines, circuits, refrigerators, etc. that use electrical/magnetic effects, and can solve the problems that the cooling capacity of thermoelectric cooling modules cannot be effectively improved, and the energy of heat sinks is increased.

Inactive Publication Date: 2017-07-07
MSI COMP SHENZHEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the cooling capacity of the current thermoelectric cooling module is limited by the heat exchange efficiency between the thermoelectric cooling chip and the heat transfer fluid, which cannot be effectively improved.
As a result, cooling chips with higher power must be used for cooling, resulting in an increase in the energy consumed by the heat sink

Method used

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  • Thermoelectric cooling module and heat dissipation device comprising same
  • Thermoelectric cooling module and heat dissipation device comprising same
  • Thermoelectric cooling module and heat dissipation device comprising same

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Embodiment Construction

[0054] The detailed features and advantages of the present invention are described in detail below in the embodiments, the content of which is sufficient to enable any person familiar with the relevant art to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the scope of the patent application and the drawings , anyone skilled in the relevant art can easily understand the related objects and advantages of the present invention. The following examples further illustrate the concept of the present invention in detail, but do not limit the scope of the present invention in any way.

[0055] First, the thermoelectric cooling module of an embodiment of the present invention is described, please refer to Figure 1 to Figure 3 . figure 1 It is a three-dimensional perspective view of a thermoelectric cooling module according to an embodiment of the present invention. figure 2 for fi...

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Abstract

The invention provides a thermoelectric cooling module and heat dissipation device comprising same. A thermoelectric cooling module includes a base, a thermoelectric cooler and a plurality of heat exchangers. The base includes a case and a cover. The case has an inlet and an outlet. The cover covers the case. The cover and the case together define an accommodation space. The inlet and the outlet are connected with the accommodation space for a heat transfer fluid to flow in and out of the accommodation space. The thermoelectric cooler is in thermal contact with the cover for exchanging heat with the cover. The heat exchangers are disposed on and in thermal contact with the cover. The heat exchangers extend from the cover into the accommodation space for exchanging heat with the heat transfer fluid in the accommodation space.

Description

technical field [0001] The invention relates to a thermoelectric cooling module and a heat dissipation device including the thermoelectric cooling module, in particular to a thermoelectric cooling module with a plurality of heat exchange elements protruding from the cover. Background technique [0002] With the development of the electronic industry, the size of electronic chips has been continuously reduced, and the computing power of electronic chips has also been continuously improved. However, with the shrinking of the size of the electronic chip and the improvement of the computing power, the heat generated by the computing of the electronic chip is also greatly increased. In order to maintain the stability of the operation of the electronic chip in the electronic device, people's requirements for the heat dissipation device are gradually increasing. [0003] At present, in most cooling devices using thermoelectric cooling modules for cooling, heat exchange is usually ...

Claims

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Application Information

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IPC IPC(8): H01L23/38H01L23/467
CPCH01L23/38H01L23/467F25B21/02F25B2321/023F25B2321/0251F28D15/0233F28D15/0275F28F1/32G06F1/20G06F2200/201H01L23/427H01L23/473F25B2321/0212F25B2700/2103F28D15/00F28D2021/0031F28F3/022F28F21/084F28F21/085
Inventor 陈正隆吴清吉廖廷伦
Owner MSI COMP SHENZHEN
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