A post-package programmable high-performance operational amplifier

An operational amplifier and high-performance computing technology, applied in the field of operational amplifiers, can solve problems such as increased testing costs, high R&D and production costs, and difficult material management, and achieve the effect of reducing R&D costs, operation and material management costs

Active Publication Date: 2021-06-29
聚洵半导体科技(上海)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The previous technology is to use the change of the topmost metal connection to realize the connection or disconnection of the switch or to make adjustments before packaging. Mask boards lead to high R&D and production costs. At the same time, in order

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  • A post-package programmable high-performance operational amplifier
  • A post-package programmable high-performance operational amplifier

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[0022] Next, the technical solutions in the embodiments of the present invention will be apparent from the embodiment of the present invention, and it is clearly described, and it is understood that the described embodiments are merely embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, there are all other embodiments obtained without making creative labor without making creative labor premises.

[0023] See Figure 1-2 The present invention provides a technical solution: a programmable high performance operational amplifier after encapsulation, including a chip body 1, an external test circuit module 3, an external data selection module 4, and an external clock 5, chip body 1 is made of power 2, an operational amplifier The body 6, the shift register 8, and the reset circuit module 9 are composed, and the output terminals of the external data selection module 4 and the external clock 5 are connected to the positive i...

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Abstract

The invention discloses a packaged programmable high-performance operational amplifier, which includes a chip body, an external test circuit module, an external data selection module and an external clock. The chip body is composed of a power supply, an operational amplifier body, a shift register, and a reset circuit. Module composition, the output terminals of the external data selection module and the external clock are connected to the positive input pin and the negative input pin of the operational amplifier body, and the output terminals of the external data selection module and the external clock are respectively connected to two switches . The packaged programmable high-performance operational amplifier, through the internal improvement of the chip body, under the joint action of the external test circuit module, external data selection module, external clock, operational amplifier body, switch, shift register and reset circuit module, It has been achieved that products of different models and performances can be produced on the same set of photomasks, thereby greatly reducing the cost of chip research and development.

Description

technical field [0001] The invention relates to the technical field of operational amplifiers, in particular to a packaged programmable high-performance operational amplifier. Background technique [0002] Operational amplifiers are widely used in consumer electronics devices, communication equipment, industrial control systems and medical devices. Because operational amplifiers are used in a wide range of fields, each application has different requirements for the performance of operational amplifiers. For example, an operational amplifier with a unity gain bandwidth of about 12 MHz is required on an electronic whiteboard, while a unit gain bandwidth is required on electric tools. Operational amplifiers with a gain bandwidth of about 500KHz, etc. Basically, each operational amplifier with unity gain bandwidth has a certain application market. In order to apply to different systems, R&D companies need to develop and produce operational amplifiers with each bandwidth. . Som...

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Application Information

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IPC IPC(8): H03G3/00
CPCH03G3/002
Inventor 蒋宇俊张智才
Owner 聚洵半导体科技(上海)有限公司
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