Composite additive for thick-gauge copper foil and its production and preparation process

A compound additive, thick gauge technology, applied in the electrolytic process, electroforming and other directions, can solve the problem of reducing the roughness of the rough surface, and achieve the effect of reducing the roughness of the rough surface, uniform crystal particles, high tensile strength and elongation performance

Active Publication Date: 2018-05-08
东强(连州)铜箔有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the technical bottleneck existing in the prior art, the present invention proposes a composite additive for thick-gauge copper foil and its production and preparation process. The design is novel, the crystal particles of the wool foil are more uniform and finer, and the roughness of the rough surface is moderately reduced, and Novel thick gauge matte foil with high tensile and elongation properties to address the deficiencies of the prior art

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] This embodiment discloses a composite additive for producing thick-gauge copper foil. The additive in this embodiment uses the following components:

[0027] The content of DPS dimethyl-dithioformamide sodium sulfonate is: 0.06g / L, and the consumption is: 0.5g / KAh; g / KAh; AEO fatty amine polyoxyethylene plating solution content: 0.1g / L, consumption: 20ml / KAh; macromolecular mass gelatin content: 1g / L, consumption: 200ml / KAh; hydrochloric acid content: : 12ppm, the consumption is: 35ml / KA, and the composite mixed additive flow rate is 200mL / min.

[0028] The process flow of composite additives in the process of depositing copper foil is as follows:

[0029] Take the electrolytic solution with copper content of 70g / L, sulfuric acid content of 100g / L, chloride ion of 30ppm, and temperature of 40°C, and then add the composite additive to the electrolytic solution so that the electrolytic solution has a flow rate of 45m 3 / h, current density 5000A / m 2 Electrodeposition wa...

Embodiment 2

[0035] This embodiment discloses a composite additive for producing thick-gauge copper foil. The additive in this embodiment uses the following components:

[0036] C8H17SO3K sodium perfluorooctane sulfonate content: 0.008g / L, consumption: 0.10g / KAh; M2-mercaptobenzimidazole content: 0.20g / L, consumption: 0.10g / KAh; PPNI hexylbenzyl Ammonium salt bath content is: 0.12g / L, and consumption is: 9ml / KAh, and macromolecular mass gelatin content is: 1.25g / L, and consumption is: 280ml / KAh; Hydrochloric acid content is: 15ppm, and consumption is: : 45ml / KAh, the composite mixed additive flow rate is 150-250mL / min.

[0037] The process flow of composite additives in the process of depositing copper foil is as follows:

[0038] The copper content in the electrolyte is 90g / L, the sulfuric acid content is 120g / L, the chloride ion is 30ppm, and the temperature is 50°C. Add organic mixed additives to the electrolyte so that the flow rate of the electrolyte is 60m 3 / h, current density 750...

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Abstract

The invention discloses a composite additive of a thick-specification copper foil and a production and preparing process of the composite additive. The composite additive comprises at least five compounds in DPS dimethyl-disulfide formamide sodium sulfonate, an MBT acid copper middle and low zone leveling agent, M2-sulfydryl benzimidazole, AEO fatty amine ethoxylate, PPNI hexyl benzyl amine salt, C8H17SO3K perfluorinated octyl sulfonate, macromolecule mass gelatin and hydrochloric acid. The thick-specification copper foil manufactured through the additive is more even and refined in electric crystalline particle, the copper foil has the high anti-pulling performance and extending rate performance, the anti-peeling strength is high, etching resistance is achieved, and the heat conduction and electric conduction performance after plate pressing is good; the above process is adopted, the copper foil aftertreatment process is reduced, and the production cost is saved; and in addition, the production efficiency is improved, and the extremely-high market prospect and economical value are achieved.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper foil production technology, in particular to a composite additive for thick-gauge copper foil and its production and preparation process. Background technique [0002] In recent years, the market demand for thick-gauge copper foil has increased rapidly, and the production and sales of thick copper-clad laminates and thick copper-layer printed circuit boards are in short supply. The rapid development of high-current substrates, power supply substrates, and heat dissipation substrates has become the main reason for the expansion of the thick copper foil market. The main application market for thick copper foil is the manufacture of high-current substrates. High-current substrates are generally high-power or high-voltage substrates. It is mostly used in automotive electronics, communication equipment, aerospace, network energy, planar transformers, power converters, power modules, etc. T...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D1/04
CPCC25D1/04
Inventor 林家宝
Owner 东强(连州)铜箔有限公司
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