Rapid edge exposure method of maskless laser direct writing photolithography equipment

Abstract

The invention provides a rapid edge exposure method of maskless laser direct writing photolithography equipment. By controlling the equipment move in the peripheral direction along the edge of a substrate to be exposed, the equipment move simultaneously along the X and Y directions, and only the edge of the substrate to be exposed is exposed. In comparison with a scanning-type exposure of the overall substrate, the invention has the following beneficial effects: movement distance of the equipment is shortened, utilization rate of a DMD system is enhanced, and productivity of the equipment is furthermore raised.

Description

technical field [0001] The invention relates to the technical field of laser direct writing lithography equipment, in particular to a fast edge exposure method for maskless laser direct writing lithography equipment. Background technique [0002] In the laser direct writing lithography equipment, the laser beam is focused on the photoresist through the lens to realize the selective exposure of the photoresist. During the exposure process, the computer controls the exposure intensity and performs autofocus. Under normal circumstances, the substrate to be exposed is placed on the machine, and the exposure process is that the machine moves at a constant speed along the X-axis direction. After one exposure step, step along the Y-axis direction once, and then proceed to the next exposure along the X-axis direction. , and so on, until the exposure of the entire substrate is completed. In some cases, it is necessary to expose the edge of the substrate. When the above exposure m...

AI Technical Summary

Problems solved by technology

In some cases, it is necessary to expose the edge of the substrate. When the above exposure method is used for edge exposure, since the entire substrate will be scanned once, the exposure efficiency is low and the equipment capacity is reduced.

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