Rapid edge exposure method of maskless laser direct writing photolithography equipment

An edge exposure, laser direct writing technology, applied in microlithography exposure equipment, optomechanical equipment, photolithography process exposure devices, etc., can solve the problems of reducing equipment production capacity, low exposure efficiency, etc., to improve equipment production capacity and reduce motion The effect of distance and improved utilization

Inactive Publication Date: 2017-07-14
HEFEI CHIP FOUND MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology

In some cases, it is necessary to expose the edge of the substrate. When the above exposure method is used for edge exposu

Method used

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  • Rapid edge exposure method of maskless laser direct writing photolithography equipment
  • Rapid edge exposure method of maskless laser direct writing photolithography equipment

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[0015] The present invention will be further described below with reference to the drawings and specific embodiments.

[0016] Such as figure 1 As shown, in the maskless laser direct writing lithography equipment, the light emitted by the exposure light source 1 enters the DMD system 2 after being adjusted by the lens, and the light is reflected by the DMD system 2 and enters the substrate 4 to be exposed on the machine 3. The exposure light source 1 is a 405nm laser. The DMD system 2 controls the switch of each pixel to obtain the desired exposure pattern. The machine 3 can move freely in the XY direction. Through the cooperation of the machine 3 and the DMD system 2, the substrate can be exposed Get any desired exposure pattern on the bottom 4.

[0017] A fast edge exposure method for maskless laser direct writing lithography equipment includes the following steps:

[0018] S1. Place the circular substrate 4 to be exposed on the machine table 3.

[0019] S2. Set the exposure mode t...

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Abstract

The invention provides a rapid edge exposure method of maskless laser direct writing photolithography equipment. By controlling the equipment move in the peripheral direction along the edge of a substrate to be exposed, the equipment move simultaneously along the X and Y directions, and only the edge of the substrate to be exposed is exposed. In comparison with a scanning-type exposure of the overall substrate, the invention has the following beneficial effects: movement distance of the equipment is shortened, utilization rate of a DMD system is enhanced, and productivity of the equipment is furthermore raised.

Description

technical field [0001] The invention relates to the technical field of laser direct writing lithography equipment, in particular to a fast edge exposure method for maskless laser direct writing lithography equipment. Background technique [0002] In the laser direct writing lithography equipment, the laser beam is focused on the photoresist through the lens to realize the selective exposure of the photoresist. During the exposure process, the computer controls the exposure intensity and performs autofocus. Under normal circumstances, the substrate to be exposed is placed on the machine, and the exposure process is that the machine moves at a constant speed along the X-axis direction. After one exposure step, step along the Y-axis direction once, and then proceed to the next exposure along the X-axis direction. , and so on, until the exposure of the entire substrate is completed. In some cases, it is necessary to expose the edge of the substrate. When the above exposure m...

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Application Information

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IPC IPC(8): G03F7/20
CPCG03F7/70358G03F7/70383G03F7/70725
Inventor 吴琼杨宇航蔡潍叶芳云曹永珍
Owner HEFEI CHIP FOUND MICROELECTRONICS EQUIP CO LTD
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