Radio frequency chip packaging structure
A packaging structure, radio frequency chip technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of large structure size, unfavorable miniaturization of electronic equipment, etc., and achieve the effect of reducing the package size
Active Publication Date: 2017-07-14
NAT CENT FOR ADVANCED PACKAGING
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Problems solved by technology
[0003] At present, most of these RF chip modules use packaged RF chips and passive components such as a large number of capacitors and inductors to be surface-mounted on the printed circuit board. The structure size after packaging is very large, which is not conducive to the miniaturization of electronic equipment.
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[0025] The embodiments of the present invention will be further described in detail below in conjunction with the drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the embodiments of the present invention, rather than to limit the embodiments of the present invention. In addition, it should be noted that, for the convenience of description, the drawings only show some but not all structures related to the embodiments of the present invention.
[0026] figure 1 It is a structural schematic diagram of a radio frequency chip packaging structure provided by an embodiment of the present invention, refer to figure 1 , the radio frequency chip package structure includes: a semiconductor substrate 11 and a package cover plate 13 arranged oppositely, and a sealing ring 12 is used for sealing between the semiconductor substrate 11 and the package cover plate 13, and the surface area of the semiconductor substrate 1...
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The embodiment of the invention provides a radio frequency chip packaging structure, and relates to the field of chip packaging. According to the radio frequency chip packaging structure, at least one first passive element and a conductive pattern are machined out on a functional region of a first lateral surface of a semiconductor substrate, at least one first passive element is electrically connected with the conductive substrate, and at least one first radio frequency chip is surface-mounted on the conductive pattern; and at least one solder ball is arranged on a second lateral surface of the semiconductor substrate, which is deviated from a packaging cover board, and at least one solder ball is electrically connected with at least one first passive element and / or at least one first radio frequency chip by a via hole. According to the radio frequency chip packaging structure provided by the embodiment of the invention, by machining at least one first passive element and the conductive pattern on the semiconductor substrate by adopting a semiconductor manufacturing process and surface-mounting at least one first radio frequency chip on the conductive pattern by adopting a surface-mounting technology, a packaging size of a radio frequency chip module is reduced.
Description
technical field [0001] The embodiments of the present invention relate to the field of chip packaging, in particular to a radio frequency chip packaging structure. Background technique [0002] With the development of science and technology, electronic equipment is gradually developing towards miniaturization, and the existing radio frequency chip modules are usually relatively large. [0003] At present, most of these RF chip modules use packaged RF chips and passive components such as a large number of capacitors and inductors to be surface-mounted on printed circuit boards. The structure size after packaging is very large, which is not conducive to the miniaturization of electronic equipment. [0004] In view of the above problems, it is necessary to provide a radio frequency chip module with a relatively small package size. Contents of the invention [0005] An embodiment of the present invention provides a radio frequency chip packaging structure, so as to provide a ...
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IPC IPC(8): H01L23/488
CPCH01L23/488H01L2224/16225H01L2224/48227H01L2224/73257H01L2924/15311H01L2924/16195
Inventor 张文奇戴风伟
Owner NAT CENT FOR ADVANCED PACKAGING