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Jig and processing method using jig

A processing method and fixture technology, which is applied to semiconductor devices, electrical components, circuits, etc., can solve problems such as poor operating efficiency and achieve the effect of efficient processing

Active Publication Date: 2017-07-28
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, when a plurality of to-be-processed objects 10 are arranged on the above-mentioned adhesive tape 11, if one end of the to-be-processed objects 10 can be aligned and arranged on a straight line, then a plurality of to-be-processed objects 10 can be processed with one operation. However, since the workpiece 10 is placed on the adhesive tape 11 manually by the operator, it is difficult to align the ends of the plurality of workpieces 10 on a straight line on the adhesive tape 11.
Therefore, each workpiece 10 is processed by photographing each workpiece 10 and measuring the distance from one end to the other end through image processing, which has a problem of poor work efficiency.

Method used

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  • Jig and processing method using jig
  • Jig and processing method using jig
  • Jig and processing method using jig

Examples

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Embodiment Construction

[0021] 1 The structure of the workpiece

[0022] figure 1 The illustrated workpiece 1 is an example of a rectangular workpiece, and is composed of, for example, a single crystal of indium phosphide (InP). The workpiece 1 has a first surface 1a on the upper side, a second surface 1b on the opposite side to the first surface 1a, a pair of side surfaces 1c extending in the longitudinal direction, and a pair of end surfaces 1d extending in the width direction. . The size of the workpiece 1 is not particularly limited. For example, the height H is 80 μm, the width W is 200 μm, and the length L is 20 mm.

[0023] 2 The structure of the jig

[0024] figure 2 The illustrated jig 2 is used when sticking a plurality of workpieces 1 on an adhesive tape, and is a jig for assisting the arrangement of the plurality of workpieces 1 . The jig 2 is composed of a plate 20 including a plurality of grooves 21 parallel to each other for fitting a plurality of workpieces 1 . The plate 20 is...

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Abstract

The present invention provides a jig and a processing method using the jig capable of processing a plurality of rectangular workpieces efficiently. A jig (2) for assisting in aligning a plurality of rectangular workpieces (1) is in the form of a plate (20) having a plurality of grooves (21) parallel to each other. The grooves (21) have respective one ends (23) aligned straight with each other and have a depth (21a) smaller than the thickness of the workpieces (1). After the workpieces (1) have been fitted in the respective grooves (21), an adhesive tape is applied to the workpieces (1) and the workpieces (1) are transferred from the jig to the adhesive tape, so that the workpieces (1) are arrayed in alignment with each other on the adhesive tape. The workpieces (1) on the adhesive tape are prevented from being placed in different positions and orientations, and can subsequently be processed efficiently.

Description

technical field [0001] The present invention relates to a jig for arranging a plurality of rectangular workpieces and a processing method using the jig. Background technique [0002] In order to divide a workpiece such as a wafer into individual chips, for example, in the scribing device shown in the following Patent Document 1, after forming dividing grooves along the lanes by a scriber, for example, the following The dicing device shown in the above-mentioned Patent Document 2 applies external force to the workpiece and breaks it into individual chips along the dividing groove. When the workpiece is divided, in order not to scatter the individual chips obtained by the division, the adhesive tape is pasted on the ring-shaped ring frame with the central opening, and the one side of the workpiece is facing upwards. The object is pasted on the other surface of the adhesive tape exposed from the opening, whereby the object to be processed is supported by the ring frame via the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L21/6836H01L2221/68327H01L21/67092H01L21/67132H01L21/6835H01L2221/68313H01L21/682H01L21/78H01L21/76B29C65/16B29C65/50B29C65/52B29C65/7802
Inventor 北原信康
Owner DISCO CORP
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