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Method for processing and removing electronic waste with a view to recovering the components included in such waste

A technology for electronic waste, waste, applied in the field of goods, which can solve problems such as environmental and health disasters

Active Publication Date: 2017-08-18
ソシエテフィナンシエールアンデュストゥリエル
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these processes are disastrous for the environment and health and end up with only minimal recovery of the material

Method used

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  • Method for processing and removing electronic waste with a view to recovering the components included in such waste

Examples

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Embodiment Construction

[0051] The steps of the process of the present invention and the means for performing these steps will be described below with reference to the accompanying drawings.

[0052] The process includes the following steps:

[0053] step 1 : Micronized

[0054] This step consists in grinding electronic waste (whole circuit boards, smart cards, etc.) until a particle powder is obtained with an average size preferably between 10 μm and 100 μm, and more preferably between about 20 μm and 50 μm. Depending on the nature of the waste and its intended composition, this grinding may be performed in one or more steps, optionally with regrinding of overly coarse particles produced by downstream particle size screening operations.

[0055] Here the target particle size is that of the metal, and grinding can result in coarser sized non-metallic particles (especially more ductile plastics) without compromising the effectiveness of the process.

[0056] Advantageously, the grinding is performe...

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Abstract

According to the invention, a method for treating electronic waste with a view to individually recovering metals included in such waste is provided. Said method is characterized in that it includes the series of the following steps: grinding the waste under conditions suitable for individually separating the different metal components of the waste; mixing the ground waste with a liquid such as to form a suspension; gravitationally separating the suspension such as to separate the particles having the highest densities and containing the majority of the metals from the particles having the lowest densities; and densimetrically separating the suspension containing the majority of the metals such as to obtain suspensions containing the individually separated metals.

Description

technical field [0001] The present invention relates to the treatment of items, especially electronic waste, with the aim of recovering the materials forming electronic waste, especially the metals used in the production of such waste, these items including plastic materials and various metals. [0002] Such waste may include circuit boards, memory cards, smart cards, and any other circuit or item equipped with discrete or integral electronic components. Background technique [0003] This electronic waste basically includes two types of materials, namely polymer materials on the one hand, and metals on the other hand, some metals are precious and some metals are not so precious, specifically (not exhaustively) silver, copper, iron, Lead, tin, gold, silver, aluminum, tantalum, palladium, and rare earth metals (lanthanides). [0004] The recovery of certain metals is today an extremely important challenge in terms of the environmental motivation to recover and recycle unusabl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B03B9/06C22B7/00
CPCB03B9/061C22B7/00C22B7/006Y02P10/20Y02W30/52B03B5/28B03B5/48B03B9/06B03C1/02C22B1/2406C22B7/005
Inventor 史蒂芬·派斯阿什利·奥萨利文
Owner ソシエテフィナンシエールアンデュストゥリエル
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