Diffusion technology for crystalline silica solar cell
A technology of solar cells and diffusion process, applied in circuits, photovoltaic power generation, electrical components, etc., can solve the problems of adverse effects of open circuit voltage and short circuit current, lower photoelectric conversion efficiency of cells, and poor uniformity of sheet resistance, etc. Reduce surface compounding and good uniformity
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0053] (1) Entering the boat: Put the silicon wafer into the diffusion furnace, set the temperature of the furnace tube at 790°C, and feed nitrogen gas at 15000 sccm.
[0054] (2) Heating: Rapidly raise the temperature to 800° C., and feed nitrogen gas at 15,000 sccm.
[0055] (3) Constant temperature: heat preservation at 800° C., and 15000 sccm of nitrogen gas is passed through.
[0056] (4) Oxidation: Oxidation was carried out at 800° C., 15000 sccm of nitrogen gas and 1000 sccm of oxygen gas were passed through for 300 s.
[0057] (5) Diffusion in the first step: heating up diffusion, the center temperature is 810°C, carrying phosphorus source nitrogen 880sccm, oxygen 600sccm, nitrogen 13500sccm, time 360s.
[0058] (6) The first step of propulsion: constant temperature propulsion, the center temperature is 810°C, the nitrogen gas is 15000 sccm, and the time is 300s.
[0059] (7) The second step of diffusion: heating up diffusion, the center temperature is 820°C, carryin...
Embodiment 2
[0068] (1) Entering the boat: Put the silicon wafer into the diffusion furnace, set the temperature of the furnace tube at 790°C, and feed nitrogen gas at 15000 sccm.
[0069] (2) Heating: Rapidly raise the temperature to 800° C., and feed nitrogen gas at 15,000 sccm.
[0070] (3) Constant temperature: heat preservation at 800° C., and 15000 sccm of nitrogen gas is passed through.
[0071] (4) Oxidation: Oxidation was carried out at 800° C., 15000 sccm of nitrogen gas and 1000 sccm of oxygen gas were passed through for 300 s.
[0072] (5) Diffusion in the first step: heating up diffusion, the central temperature is 810°C, carrying phosphorus source nitrogen 840sccm, oxygen 600sccm, nitrogen 13500sccm, time 360s.
[0073] (6) The first step of propulsion: constant temperature propulsion, the center temperature is 810°C, the nitrogen gas is 15000 sccm, and the time is 300s.
[0074] (7) The second step of diffusion: heating up diffusion, the center temperature is 820°C, carryi...
Embodiment 3
[0084] (1) Entering the boat: Put the silicon wafer into the diffusion furnace, set the temperature of the furnace tube at 790°C, and feed nitrogen gas at 15000 sccm.
[0085] (2) Heating: Rapidly raise the temperature to 800° C., and feed nitrogen gas at 15,000 sccm.
[0086] (3) Constant temperature: heat preservation at 800° C., and 15000 sccm of nitrogen gas is passed through.
[0087] (4) Oxidation: Oxidation was carried out at 800° C., 15000 sccm of nitrogen gas and 1000 sccm of oxygen gas were passed through for 300 s.
[0088] (5) The first step of diffusion: heating up diffusion, the center temperature is 810°C, carrying phosphorus source nitrogen 820sccm, oxygen 600sccm, nitrogen 13500sccm, time 360s.
[0089] (6) The first step of propulsion: constant temperature propulsion, the center temperature is 810°C, the nitrogen gas is 15000 sccm, and the time is 300s.
[0090] (7) The second step of diffusion: heating up diffusion, the center temperature is 820°C, carryin...
PUM
| Property | Measurement | Unit |
|---|---|---|
| Resistance | aaaaa | aaaaa |
| Resistance | aaaaa | aaaaa |
| Resistance | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 

