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Sputtering device and sputtering method

A sputtering device and target position technology, which is applied in the field of display panel preparation, can solve the problems of inability to guarantee the sputtering surface of the target material, and reduce the uniformity of film formation, so as to improve the utilization rate, improve the uniformity, and improve the surface uniformity. Effect

Active Publication Date: 2017-08-29
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the target is usually composed of multiple target strips. Due to the different consumption levels of the target strips at different positions, it is impossible to ensure that the sputtering surface of the target at each position is flat, which will lead to film formation. Reduced uniformity

Method used

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  • Sputtering device and sputtering method
  • Sputtering device and sputtering method
  • Sputtering device and sputtering method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Please refer to Figure 1 to Figure 4 , this embodiment provides a sputtering device, including a plurality of target positions 1 for carrying targets (not shown in the figure), the sputtering device also includes a control unit 2 and a plurality of support units 3, and the target positions 1 are located at On the support unit 3 , the control unit 2 is electrically connected to the support unit 3 , and each support unit 3 is used to raise or lower the target position 1 on it under the control of the control unit 2 .

[0032] From figure 1 It can be seen from the figure that the number of target positions 1 is multiple. Preferably, support units 3 are respectively set at the positions of each target position 1, that is, the number of target positions 1 is the same as the number of support units 3, and one support unit 3 corresponds to a target position 1; the target is located on the upper surface of the target position 1, and the support unit 3 is located on the lower ...

Embodiment 2

[0053] Please refer to Figure 5 , the present embodiment provides a sputtering method, comprising:

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Abstract

The invention provides a sputtering device and a sputtering method and belongs to the technical field of preparation of display panels, and can solve the problem that an existing sputtering device is low in uniformity of target film formation. The sputtering device provided by the invention comprises a plurality of target positions for bearing targets. The sputtering device also comprises a control unit and a plurality of supporting units. The target positions are on the supporting units, the control unit is electrically connected to the supporting units, and each supporting unit is used for making the target position thereon ascend or descend under control of the control unit.

Description

technical field [0001] The invention belongs to the technical field of display panel preparation, and in particular relates to a sputtering device and a sputtering method. Background technique [0002] For a long time, problems such as the uniformity of the magnetron sputtering coating and the utilization rate of the target have always affected the film-forming characteristics of the target. At present, especially in the Oxide AMOLED process in the development stage, there are extremely high requirements for the uniformity and stability of the oxide film layer. Solving the uniformity of the magnetron sputtering coating and the utilization rate of the target will become the key to the Oxide AMOLED technology. . [0003] In the prior art, the target is usually composed of multiple target strips. Due to the different consumption levels of the target strips at different positions, it is impossible to ensure that the sputtering surface of the target at each position is flat, whi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34C23C14/35C23C14/50C23C14/54
CPCC23C14/3464C23C14/352C23C14/50C23C14/54
Inventor 胡迎宾丁远奎刘宁赵策丁瑞
Owner BOE TECH GRP CO LTD