Substrate cavity capable of realizing uniform heat dissipation at bottom

Abstract

The invention discloses a substrate cavity capable of realizing uniform heat dissipation at the bottom. The substrate cavity comprises a substrate and heat dissipation fins, wherein a water storage layer is arranged in the substrate; an opening surface is arranged on one side surface of the substrate; a water inlet is formed in the upper part of the opening surface, and a water outlet is formed in the lower part of the opening surface; each of the water inlet and the water outlet is closed by a movable plug; at least one stirring device is arranged in the water storage layer; and the stirring devices are connected with the bottom of the substrate. According to the substrate cavity capable of realizing uniform heat dissipation at the bottom, the conventional heat dissipation structure simultaneously adopts the substrate and the heat dissipation fins for heat dissipation, the substrate is in contact with a heat source to transfer heat to the heat dissipation fins in a heat conduction manner, and the heat dissipation fins are in contact with air, so as to carry away heat; and during the practical using process, a large-sized heat dissipation device has the problem that the bottom of the substrate is heated non-uniformly, so that heat transferred to the heat dissipation fins is non-uniform, which leads to disadvantages in two aspects: firstly, the heat dissipation speed is reduced due to non-uniform heating; secondly, the heat dissipation fins and the substrate adopt an integrated structure, and therefore the heat dissipation fins are easy to age and damage due to excessive heat dissipation at a local part.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a substrate cavity with uniform heat dissipation at the bottom. Background technique [0002] The heat dissipation method refers to the main way the radiator dissipates heat. In thermodynamics, heat dissipation is heat transfer, and there are three main ways of heat transfer: heat conduction, heat convection and heat radiation. The transfer of energy by itself or when matter comes into contact with matter is known as heat conduction, and it is the most common form of heat transfer. Convection refers to the transfer of heat by a moving fluid that carries heat away. Thermal radiation refers to the transfer of heat by ray radiation, the most common of which is solar radiation. These three heat dissipation methods are not isolated. In daily heat transfer, these three heat dissipation methods all occur at the same time and work together. In fact, any type of radiator basically uses the...

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is that the bottom of the substrate is heated unevenly, resulting in uneven heat transfer to the heat sink. The problem of uneven heat on the chip

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