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Interposer for Electrical Interconnection with Spring

A technology of interposer and cantilever spring, applied in instruments, sounding instruments, organ motion/change detection, etc., can solve problems such as infeasibility of flexible circuit desoldering

Active Publication Date: 2020-06-30
KONINKLJIJKE PHILIPS NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, it may not be feasible to desolder a flex circuit, so if one circuit fails, both the flex circuit and associated parts may need to be replaced

Method used

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  • Interposer for Electrical Interconnection with Spring
  • Interposer for Electrical Interconnection with Spring
  • Interposer for Electrical Interconnection with Spring

Examples

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Embodiment Construction

[0018] The following descriptions of certain exemplary embodiments are merely exemplary in nature and are in no way intended to limit the invention or its application or uses. In the following detailed description of embodiments of the present system and method, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration, in which the described Specific embodiments of the systems and methods described above. These embodiments have been described in sufficient detail to enable those skilled in the art to practice the presently disclosed systems and methods, and it will be understood that other embodiments may be utilized and that other embodiments may be utilized without departing from the spirit and scope of the present system. Structural and logical changes are made below.

[0019] Accordingly, the following detailed description is not given in a limiting sense, and the scope of the present system is defined only by ...

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PUM

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Abstract

An interposer with a spring on a surface of the interposer is disclosed. The spring may apply a force to a surface of a component adjacent to the interposer. The interposer may be secured to the surface by a fastener. The fastener may be offset from the center of the interposer. The fastener may be a fulcrum of a lever including the interposer and the spring. The spring may cause a portion of the interposer on the other side of the fastener from the spring to apply an increased amount of pressure to the surface to which the interposer is secured. A transesophageal exam ultrasound probe including an interposer is disclosed.

Description

Background technique [0001] Transesophageal examination (TEE) and catheter ultrasound probes can be designed with limited external dimensions to access areas of the interior of the body that are difficult to reach with conventional external ultrasound probes. For example, a TEE probe may be placed in the esophagus to perform echocardiography. In order to maintain limited external dimensions, the flex circuit may be coupled to a transducer array and / or other hardware located in the distal end of the endoscopic device. The flexible circuit can then be coupled to a second flexible circuit that can provide power and communicate with an ultrasound imaging system disposed at the proximal end of the device. The flexible circuit may provide a small electrical assembly within the confines of a probe designed to access internal regions of the body. [0002] Joining flex circuits can be difficult and time consuming because surface soldering of various joints may be required. Soldered ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A61B8/12A61B8/08A61B8/00G10K11/00
CPCA61B8/0883A61B8/12A61B8/445G10K11/004
Inventor D·F·库斯库纳
Owner KONINKLJIJKE PHILIPS NV