Microelectromechanical system (MEMS) package

Abstract

The invention relates to a package comprising a base structure (102) which comprises an electrically insulating material and/or an electrically conductive contact structure (110), an electronic component (104) which is embedded in the base structure (102) or on the base structure (102), a microelectromechanical system (MEMS) component (106) and a cover structure (108) which is mounted on the base structure (102) to at least partially cover the MEMS component (106)

Description

technical field [0001] The invention relates to a package, an arrangement and a method for manufacturing an electronic device. Background technique [0002] Firstly, MEMS components (microelectromechanical systems, micro-electromechanical systems) are fabricated with traditional semiconductor tools. Special requirements regarding eg dimensions, materials, shapes etc. lead to the development of specialized processes. These further developments over the original state resulted in the inability to fabricate control ICs on the same substrate as the MEMS components themselves. Even with the introduction of CMOS-compatible processes (which enabled single-chip MEMS / ICs), the vast majority of MEMS applications separate the sensor / actuator from the control system. With the trend of progress towards smaller form factors and increased efficiency at lower cost, there is room for further developments in view of heterogeneous integration. Contents of the invention [0003] It is an o...

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Problems solved by technology

These further developments relative to the original state lead to the inability to fabricate the control IC on the same substrate as the MEMS part itself

Even with the in

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