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Optical module

An optical module and laser driver technology, applied in the field of optical modules, can solve problems such as heat dissipation of optical module lens components

Inactive Publication Date: 2017-09-01
HISENSE BROADBAND MULTIMEDIA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] This application provides an optical module to solve the problem of heat dissipation in the lens assembly of the optical module

Method used

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Embodiment Construction

[0018] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with aspects of the invention as recited in the appended claims.

[0019] The optical module is the carrier used for transmission between the switch and the device, and has the function of photoelectric change. The working frequency of the optical module is high, therefore, the power consumption is large and the heat generated is large during the working process.

[0020] The optical module provided by the embodiment of the present application can effectively ...

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Abstract

The invention discloses an optical module comprising a circuit board, a lens assembly, a laser driver and a limiting amplifier. The upper surface and the lower surface of the circuit board are respectively provided with a heat dissipation layer. The laser driver and the limiting amplifier are mounted on the surface of the heat dissipation layer on the upper surface of the circuit board. The lens assembly is configured to cover the laser driver and the limiting amplifier. Within the projection area of the laser driver and the limiting amplifier on the circuit board, the circuit board is provided with a plurality of through holes. The plurality of through holes penetrate through the circuit board and are respectively connected with the heat dissipation layers on the upper surface and the lower surface of the circuit board. Heat conductive bodies are filled inside the through holes. The heat conductive bodies are respectively connected with the heat dissipation layers on the upper surface and the lower surface of the circuit board. The optical module effectively dissipates the heat generated by the laser driver and the limiting amplifier inside the lens assembly. Therefore, the internal temperature of the optical module is reduced.

Description

technical field [0001] The present application relates to the technical field of heat dissipation, and in particular to an optical module. Background technique [0002] The optical module is a photoelectric and electro-optical conversion device composed of optoelectronic devices, functional circuits, and optical interfaces. It mainly includes a transmitting component and a receiving component. Among them, the transmitting component converts electrical signals into optical signals. The receiving component then converts the optical signal into an electrical signal. [0003] see figure 1 middle figure 1 a and figure 1 b, figure 1 a is a structural schematic diagram of an optical module; figure 1 b is a schematic cross-sectional structure diagram of an optical module. Such as figure 1 a and figure 1 As shown in b, the optical module includes a circuit board 1, a transmitting component, a receiving component and a lens component 2, wherein the transmitting component and t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/42
CPCG02B6/4269
Inventor 郑龙
Owner HISENSE BROADBAND MULTIMEDIA TECH