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Conductive silver paste

A technology of conductive silver paste and silver particles, applied to the conductive layer on the insulating carrier, the conductive material dispersed in the non-conductive inorganic material, etc., can solve the problem that the PET base material is difficult to withstand the temperature of 150 ℃, and the rare metal indium mining reserves limited, metal silver grid line side wall cracking and other problems, to achieve the effect of improving conductivity, close in size and tight arrangement

Active Publication Date: 2019-04-19
SUZHOU INAINK ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Traditional ITO films have the following defects in terms of flexibility, conductivity and light transmittance: relatively high production costs; limited reserves of rare metal indium; relatively brittle materials; low infrared transmittance, which limits the application in flexible electrodes
[0006] In the prior art, the function of transparent conduction can be partially realized by using common non-specialized silver paste for metal grids. However, the existing silver paste has some interactions with polymer substrates such as PET (polyethylene terephthalate). Problems such as low adhesion, easy to fall off, broken grid lines, and cracked side walls of metal silver grid lines have greatly affected product yield, especially on PET substrates larger than 50 inches, broken lines, cracked side walls, etc. The problem seriously reduces the yield of the product
At the same time, the heating temperature is above 150°C. Due to the influence of heating and stretching, it is difficult for the PET substrate to withstand the temperature of 150°C.

Method used

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  • Conductive silver paste
  • Conductive silver paste
  • Conductive silver paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Recipe 1:

[0040]A kind of conductive silver paste, comprises each component of following mass percentage:

[0041] Submicron silver particles: the surface is modified with butylamine and n-hexylamine, the particle size is 100nm-400nm, and the mass percentage is 73.0%;

[0042] Nanoscale silver particles: the surface is modified with methylamine and isopropylamine, the particle size is 3nm-10nm, and the mass percentage is 7.0%;

[0043] Organic solvent: diethylene glycol monobutyl ether, the mass percentage is 12.75%;

[0044] Diluent: methacrylic acid, the mass percentage is 0.5%; The mass percentage of isooctyl acrylate is 0.5%;

[0045] Resin: cellulose acetate butyrate, the mass percentage is 3.0%; Acrylic resin, the mass percentage is 1.25%;

[0046] Organic additives: leveling agent, TEGO Flow 425 (Tego additives), 2% by mass.

[0047] The preparation method of above-mentioned conductive silver paste is as follows:

[0048] (1) Preparation of resin solution:...

Embodiment 2

[0052] Recipe 2:

[0053] A kind of conductive silver paste, comprises each component of following mass percentage:

[0054] Submicron silver particles: the surface is modified with butylamine and n-hexylamine, the particle size is 200nm-500nm, and the mass percentage is 75%;

[0055] Nanoscale silver particles: the surface is modified with ethylamine and tert-butylamine, the particle size is 12nm-18nm, and the mass percentage is 5%;

[0056] Organic solvent: dimethyl succinate, the mass percentage is 12.0%;

[0057] Diluent: butyl methacrylate, the mass percentage is 2%;

[0058] Resin: polyurethane resin, the mass percentage is 4.0%;

[0059] Organic additives: leveling agent, TEGO Flow 300 (Tego additive), 1% by mass; adhesion promoter, NPEF-198 (Nanya, Taiwan, China), 1% by mass.

[0060] The preparation method of above-mentioned conductive silver paste is as follows:

[0061] (1) Preparation of resin solution: 4.0 g of resin (pellets) and 12.0 g of organic solvent we...

Embodiment 3

[0065] Recipe 3:

[0066] A kind of conductive silver paste, comprises each component of following mass percentage:

[0067] Submicron silver particles: the surface is modified with n-octylamine and ethyl mercaptan, the particle size is 300nm-600nm, and the mass percentage is 77%;

[0068] Nano-scale silver particles: the surface is modified with n-hexylamine, the particle size is 20nm-25nm, and the mass percentage is 3%;

[0069] Organic solvent: dimethyl adipate, the mass percentage is 8.0%; Isophordione, the mass percentage is 4.0%;

[0070] Diluent: trimethylolpropane triacrylate, the mass percentage is 3%;

[0071] Resin: vinyl chloride-vinyl acetate copolymer resin, the mass percentage is 4.0%;

[0072] Organic additives: leveling agent, TEGO Flow 400 (Tego additives), 0.5% by mass; defoamer BYK-052 (Byk Chemicals), 0.5% by mass.

[0073] The preparation method of above-mentioned conductive silver paste is as follows:

[0074] (1) Preparation of resin solution: 4.0 ...

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Abstract

The invention relates to conductive silver paste. The conductive silver paste comprises an organic carrier and silver particles, wherein surfaces of the silver particles are modified with organic compounds, the silver particles comprise submicron silver particles and nanoscale silver particles, the grain sizes of the submicron silver particles are 100-1,000 nanometers, and the grain sizes of the nanoscale silver particles are 2-50 nanometers. In the conductive silver paste, the organic compounds for surface modification can be decomposed or detached under a relatively low braking temperature, so that the organic compounds are removed from the surfaces of the silver particles in a gaseous state, and meanwhile, the nanoscale silver particles and the submicron silver particles can be sintered together; and a conductive thin film is prepared by using the conductive silver paste, the conductivity of the transparent conductive thin film can be effectively improved, the yield is improved, and the cost is saved.

Description

technical field [0001] The invention relates to the technical field of electronic paste, in particular to a conductive silver paste. Background technique [0002] Transparent conductive films are used in a wide range of fields, including touch screens, flexible displays, OLED lighting, and solar cells. In optoelectronic devices such as flexible displays or lighting, touch screens, high-performance transparent electrodes are an important part of the device. As a semiconductor transparent film, the transparent conductive film ITO (Indium Tin Oxide) contains about 30% indium element, and indium ore is a rare mineral with scarce sources and expensive prices. The estimated global indium reserves are only about 50,000 tons, of which Mining accounts for 50%, and the vacuum ITO sputtering technology coating cost is high; after the film is formed, it is etched by laser to produce the required pattern, and a large part of the raw materials are wasted in the etching process. Huge and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B5/14
CPCH01B1/22H01B5/14
Inventor 孙宝全宋涛
Owner SUZHOU INAINK ELECTRONICS MATERIALS CO LTD