Conductive silver paste
A technology of conductive silver paste and silver particles, applied to the conductive layer on the insulating carrier, the conductive material dispersed in the non-conductive inorganic material, etc., can solve the problem that the PET base material is difficult to withstand the temperature of 150 ℃, and the rare metal indium mining reserves limited, metal silver grid line side wall cracking and other problems, to achieve the effect of improving conductivity, close in size and tight arrangement
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Embodiment 1
[0039] Recipe 1:
[0040]A kind of conductive silver paste, comprises each component of following mass percentage:
[0041] Submicron silver particles: the surface is modified with butylamine and n-hexylamine, the particle size is 100nm-400nm, and the mass percentage is 73.0%;
[0042] Nanoscale silver particles: the surface is modified with methylamine and isopropylamine, the particle size is 3nm-10nm, and the mass percentage is 7.0%;
[0043] Organic solvent: diethylene glycol monobutyl ether, the mass percentage is 12.75%;
[0044] Diluent: methacrylic acid, the mass percentage is 0.5%; The mass percentage of isooctyl acrylate is 0.5%;
[0045] Resin: cellulose acetate butyrate, the mass percentage is 3.0%; Acrylic resin, the mass percentage is 1.25%;
[0046] Organic additives: leveling agent, TEGO Flow 425 (Tego additives), 2% by mass.
[0047] The preparation method of above-mentioned conductive silver paste is as follows:
[0048] (1) Preparation of resin solution:...
Embodiment 2
[0052] Recipe 2:
[0053] A kind of conductive silver paste, comprises each component of following mass percentage:
[0054] Submicron silver particles: the surface is modified with butylamine and n-hexylamine, the particle size is 200nm-500nm, and the mass percentage is 75%;
[0055] Nanoscale silver particles: the surface is modified with ethylamine and tert-butylamine, the particle size is 12nm-18nm, and the mass percentage is 5%;
[0056] Organic solvent: dimethyl succinate, the mass percentage is 12.0%;
[0057] Diluent: butyl methacrylate, the mass percentage is 2%;
[0058] Resin: polyurethane resin, the mass percentage is 4.0%;
[0059] Organic additives: leveling agent, TEGO Flow 300 (Tego additive), 1% by mass; adhesion promoter, NPEF-198 (Nanya, Taiwan, China), 1% by mass.
[0060] The preparation method of above-mentioned conductive silver paste is as follows:
[0061] (1) Preparation of resin solution: 4.0 g of resin (pellets) and 12.0 g of organic solvent we...
Embodiment 3
[0065] Recipe 3:
[0066] A kind of conductive silver paste, comprises each component of following mass percentage:
[0067] Submicron silver particles: the surface is modified with n-octylamine and ethyl mercaptan, the particle size is 300nm-600nm, and the mass percentage is 77%;
[0068] Nano-scale silver particles: the surface is modified with n-hexylamine, the particle size is 20nm-25nm, and the mass percentage is 3%;
[0069] Organic solvent: dimethyl adipate, the mass percentage is 8.0%; Isophordione, the mass percentage is 4.0%;
[0070] Diluent: trimethylolpropane triacrylate, the mass percentage is 3%;
[0071] Resin: vinyl chloride-vinyl acetate copolymer resin, the mass percentage is 4.0%;
[0072] Organic additives: leveling agent, TEGO Flow 400 (Tego additives), 0.5% by mass; defoamer BYK-052 (Byk Chemicals), 0.5% by mass.
[0073] The preparation method of above-mentioned conductive silver paste is as follows:
[0074] (1) Preparation of resin solution: 4.0 ...
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