Encapsulation structure of electronic element

Abstract

The invention discloses an encapsulation structure of an electronic element. The encapsulation structure comprises an element body, an upper sealing plate and a lower sealing plate, wherein the upper sealing plate is positioned above the element body; the lower sealing plate is positioned under the element body; a reverse T-shaped first article placing passage is arranged on the inner wall of the bottom of the upper sealing plate; guide posts are respectively and fixedly connected with the two ends of the outer wall of the bottom of the upper sealing plate; installing grooves in symmetrical arrangement are arranged on the outer wall of the guide post; a spring is fixedly connected in the installing groove; a movable plate in inclined arrangement is fixedly connected with one end, far away from the installing groove, of the spring; a rotating rod is fixedly connected with the bottom of the movable plate, and is rotationally connected onto the guide post; a second article storage passage positioned on the top of the lower sealing plate is arranged under the guide post. The encapsulation structure has the advantages that the encapsulation of the element body is convenient, so that the component can be replaced in time when being damaged; the component of the encapsulation structure can be repeatedly utilized; the resources are saved, so that the connection of the electronic element during the transportation is firm; the operation is simple; the use is convenient.

Description

technical field [0001] The invention relates to the technical field of packaging devices, in particular to a packaging structure for electronic components. Background technique [0002] Packaging refers to connecting the circuit pins on the silicon chip to the external joints with wires, so as to facilitate the connection of other devices. Package form refers to the housing used to install semiconductor integrated circuit chips. It not only plays the role of installing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also connects the contacts on the chip to the pins of the package shell with wires, and these pins pass through the wires on the printed circuit board. Connect with other devices to realize the connection between the internal chip and the external circuit. Because the chip must be isolated from the outside world to prevent impurities in the air from corroding the chip circuit and causing electrical performance degradation...

AI Technical Summary

Problems solved by technology

[0003] The packaging structure of electronic components in the prior art is inconvenient to transport, and when the electronic components are damaged, the packaging structure used together with the electronic components will be discarded together with the electronic components, resulting in a waste of resources

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