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Flexible display mother board and fabrication method and cutting method thereof

A flexible display and cutting method technology, applied in semiconductor/solid-state device manufacturing, photovoltaic power generation, electrical components, etc., can solve the problem of large consumables, and achieve the effect of reducing consumables

Inactive Publication Date: 2017-09-08
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing cutting equipment is generally a laser cutting machine, and the hard carrier board will also be cut during the cutting process, resulting in large consumables

Method used

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  • Flexible display mother board and fabrication method and cutting method thereof
  • Flexible display mother board and fabrication method and cutting method thereof
  • Flexible display mother board and fabrication method and cutting method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] figure 1 It is a schematic structural diagram of a flexible display motherboard provided by Embodiment 1 of the present invention, figure 2 for figure 1 The top view of the flexible display motherboard shown, such as figure 1 with figure 2 As shown, the flexible display motherboard includes: a hard base substrate 1 and a flexible base substrate 2 located on one side of the hard base substrate. The flexible base substrate 2 is divided into a cutting area 1a and a non-cutting area 1b. A heating pattern 3 is formed on the side of the base substrate 1 facing the flexible substrate 2 and corresponding to the cutting area 1a, and the heating pattern 3 is used to generate heat to cut the cutting area 1a.

[0041] Optionally, the heat-generating pattern 3 is made of an electro-heating material, and the heat-generating pattern 3 generates heat after an electric current is applied. Preferably, the material of the heating pattern 3 is a material with high electrothermal conv...

Embodiment 2

[0058] Figure 4 A schematic structural diagram of a flexible display motherboard provided in Embodiment 2 of the present invention, as shown in Figure 4 As shown, the difference from the first embodiment above is that the heating pattern 3 in this embodiment is located inside the flexible substrate 2 .

[0059] In this embodiment, considering that the thickness of the flexible substrate 2 is relatively thick, the cutting of the flexible substrate 2 requires more energy. By placing the heating pattern in the flexible substrate 2, the actual cutting thickness of the heating pattern can be reduced, thereby effectively reducing the energy required for the cutting process. Preferably, the distance between the heating pattern 3 and the upper and lower surfaces of the flexible substrate 2 is equal, and at this time, the energy required for cutting the flexible substrate 2 is minimum.

[0060] Figure 5 It is a schematic diagram of the heating pattern located in the flexible subs...

Embodiment 3

[0072] Figure 7 A schematic structural diagram of a flexible display motherboard provided in Embodiment 3 of the present invention, as shown in Figure 7 As shown, different from the first and second embodiments above, the heating pattern 3 in this embodiment is located on the side of the flexible substrate 2 facing away from the hard substrate 1 .

[0073] In this embodiment, it is considered that several display function layers 4 are generally provided in the flexible display motherboard for displaying. If the heat generation pattern is too far away from the display function layer 4, the display function layer 4 cannot be cut. For this reason, in this embodiment, the heating pattern 3 is arranged on the side of the flexible substrate facing away from the hard substrate.

[0074] In addition, considering the thickness of the flexible substrate 2 is relatively thick, the cutting of the flexible substrate 2 requires more energy. If the heating pattern 3 is too far away from t...

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Abstract

The invention discloses a flexible display mother board and a fabrication method and cutting method thereof. The flexible display mother board comprises a hard substrate and a flexible substrate, wherein the flexible substrate is arranged at one side of the hard substrate, the flexible substrate is divided into a cutting region and a non-cutting region, a heat generation pattern is formed at one side, facing the flexible substrate, of the hard substrate and is corresponding to the cutting region, and the heat generation pattern is used for generating heat after a current is applied. When the flexible display mother board is needed to be cut, a current with a relatively large current value is only needed to be applied to the heat generation pattern, the heat generation pattern instantaneously generates high heat to cut the cutting region of the flexible substrate, and at the moment, the hard substrate is maintained complete. During cutting the flexible display mother board provided by the invention, the hard substrate can be enabled not to be cut and can be further repeatedly used, and material consumption is effectively reduced.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a flexible display motherboard, a preparation method and a cutting method thereof. Background technique [0002] In the prior art, the preparation of the flexible substrate needs to be completed on a rigid carrier. After the flexible substrate is prepared, the entire substrate is cut with a cutting device to obtain several small-sized substrates. Finally, the rigid carrier is The peeling process is performed with the flexible substrate to obtain a small-sized flexible substrate. The existing cutting equipment is generally a laser cutting machine, and the hard carrier board will also be cut during the cutting process, resulting in large consumables. Contents of the invention [0003] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a flexible display motherboard, a preparation method and a cutting method thereof...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L51/56
CPCH10K77/111H10K50/844H10K71/00Y02E10/549
Inventor 杨栋芳
Owner BOE TECH GRP CO LTD
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